NFC Chip Market is expected to reach US$ 4.97 Bn by the end of 2031,
KDPOF and Keysight Present a Joint Demo of Automotive Ethernet Transmission over Corning ClearCurve® Multi-mode
Distec Presents Robust and Low-maintenance „BoxPC Pro NPA-2009“ for Info Terminals, Medical Technology and Transportation
Switch Evaluation Board EVB9351-AUT-SW-NXP Implements NXP SJA1110 SoCs and 1000BASE-RH Optical Ports for Connected Driving
Versatile Materials for Improved Efficiency of 5G Applications New York, Düsseldorf and Tokyo – 21
Sustainably manufactured in Europe and available for immediate delivery Dortmund/Germany, 20 September 2022. tde –
ARIES Embedded Serves Manifold Project Requirements with Flexible and Powerful FPGA- and CPU-based Modules ARIES
Optical interconnects to become an indispensable part in future cars TRUMPF Photonic Components and KDPOF
Test Houses Welcome New Small Form-factor Pluggable Transceiver Module for Evaluation of Optical Gigabit Ethernet
New OSM-compatible SiP Integrates ST Microelectronics‘ STM32MP1 MPU with Arm CortexA7/M4 for Industrial and IoT