Prototypes in Development for 10GBASE-AU Proof-of-Concept of Optical In-vehicle Multi-gigabit Links KDPOF (leading supplier for
Presentation of Next-generation High-speed Connectivity up to 50 Gb/s over Glass Optical Fiber for ADAS
Combined Hardware and Software Expertise to Further Embedded Modules with Microchip“s PolarFire® SoC Architecture ARIES
Distec GmbH, one of the leading German specialists for industrial TFT flat panel displays, embedded
NFC Chip Market is expected to reach US$ 4.97 Bn by the end of 2031,
KDPOF and Keysight Present a Joint Demo of Automotive Ethernet Transmission over Corning ClearCurve® Multi-mode
Distec Presents Robust and Low-maintenance „BoxPC Pro NPA-2009“ for Info Terminals, Medical Technology and Transportation
Switch Evaluation Board EVB9351-AUT-SW-NXP Implements NXP SJA1110 SoCs and 1000BASE-RH Optical Ports for Connected Driving
Versatile Materials for Improved Efficiency of 5G Applications New York, Düsseldorf and Tokyo – 21
Sustainably manufactured in Europe and available for immediate delivery Dortmund/Germany, 20 September 2022. tde –