Tag Archives: Wafer

Electric Electronics

ERS boosts productivity in FOWLP debonding and wafer testing

Semicon China: Hall W4, Booth 4143-1

ERS boosts productivity in FOWLP debonding and wafer testing

ERS‘ debonding machines for FOWLP (Fan-out Wafer-Level Packaging) (Source: ERS electronic GmbH)

MUNICH, 22 February 2017 – ERS electronic GmbH, the innovation leader in the market of Fan-out Wafer-Level Packaging (FOWLP) debonding and thermal test solutions for semiconductor production, will showcase its latest technology developments at Semicon China in Shanghai (March 14 – 16).

ERS is resuming its presence at Semicon China after 12 years with the introduction of several new products that significantly increase FOWLP debonding and wafer test throughput. „With many independent technology developments, the semiconductor equipment market of mainland China has reached a high degree of maturity and is developing impressive dynamics,“ explained Klemens Reitinger, Managing Director of ERS electronic GmbH. „At the present level of technological differentiation, highly sophisticated products and specialized expertise are in high demand. This translates into excellent prospects for our business.“

Video presentations of four new debonding machines for FOWLP (Fan-out Wafer-Level Packaging) manufacturing processes will take center stage of ERS“ Semicon China“s presence. These machines – type designations ADM330, WAT330, MDM330, MWAT330 – are covering the entire range of debonding and warpage adjust application environments from prototype lab to fully-automated high-volume production, offering carefully graduated combinations of high throughput and flexibility for the respective environments. Based on ERS“ long-standing experience with design and applications of such products, the four new machines have already been put through their paces at ERS“ development facilities and are now ready for market launch with immediate start of series production. „Fully automatic machines that ensure higher productivity and flexibility for the user – this is what currently is the focus of our customers“ demand,“ commented Reitinger.

ERS will share its booth at Semicon China with its distribution partners Chain Logic International Corp. (CLIC) and MPI Corp.

ERS electronic GmbH, based in Germering near Munich (Germany), has been producing innovative thermal test solutions for the semiconductor industry for 45 years. The company has gained an outstanding reputation in the sector, notably with its fast and accurate thermal chuck systems for test temperatures ranging from -65°C to +500°C for analytical, parameter-related and manufacturing tests. Today, thermal chuck systems developed by ERS in its product families AC3, AirCool©, AirCool© plus and PowerSense© are an integral component in all larger-sized wafer probers right across the chip industry.

Firmenkontakt
ERS electronic GmbH
Klemens Reitinger
Stettinerstraße 3+5
82110 Germering
+49-89-8941320
kreitinger@ers-gmbh.de
http://www.ers-gmbh.com

Pressekontakt
Brand+Image
Timothy Göbel
Von-Eichendorff-Str. 41
86911 Dießen a.A.
08807 9475642
ERS@brandandimage.de
http://www.brandandimage.de

Electric Electronics

ERS ready for imminent eWLB upswing

Emerging semiconductor manufacturing technology

ERS ready for imminent eWLB upswing

(Source: ERS electronic GmbH)

MUNICH, August 2, 2016 – ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor production, sees excellent growth opportunities in the emerging eWLB / FOWLP (Fan Out Wafer Level Packaging) advanced packaging technology. ERS expects this market to grow at a pace of more than 30 per cent annually – and ERS is extremely well positioned to benefit from this situation.

eWLB (Embedded Wafer-Level Ball Grid Array) is a very economical packaging technology for the advanced semiconductor solutions required for innovative application areas such as Internet of Things, sensors, automation and mobility. It enables semiconductor manufacturers to create chips with smaller footprint, thinner package and better electrical properties than possible with conventional flip-chip BGA packaging. Therefore it is a crucial technology to create space-saving yet powerful solutions. Since this technology is already proven in mass production at renowned semiconductor manufacturers and offers substantial technological and cost benefits, it can be expected that it will reach a very high popularity throughout the entire semiconductor industry.

Due to its world-leading thermal expertise, ERS has been involved in the development of this technology from its inception. For more than six years, ERS“ equipment is deployed in the most demanding mass-production environments at leading semiconductor manufacturers and OSATS worldwide. For this reason, ERS has a unique position in the emergent dynamic market for eWLB manufacturing equipment and will fully benefit from the rising demand for such equipment. With its sound experience in thermal treatment as well as in eWLB manufacturing processes, ERS can support manufacturers to get their processes stable and economic and can adapt its equipment quickly to new requirements.

On the basis of this unique set of capabilities and expertise, ERS has won two major customers in this global market within only six months. Through its eWLB Competence Center, located at the ERS headquarters near Munich, ERS is actively involved into further developing the technology. This enables the company to quickly react on changing market and technology conditions. Even more important, through this Competence Center ERS is an active eWLB technology player and has immediate access to all new developments from their beginning.

ERS electronic GmbH, based in Germering near Munich, has been producing innovative thermal test solutions for the semiconductor industry for 45 years. The company has gained an outstanding reputation in the sector, notably with its fast and accurate thermal chuck systems for test temperatures ranging from -65°C to +500°C for analytical, parameter-related and manufacturing tests. Today, thermal chuck systems developed by ERS in its product families AC3, AirCool©, AirCool© plus and PowerSense© are an integral component in all larger-sized wafer probers right across the chip industry.

Firmenkontakt
ERS electronic GmbH
Klemens Reitinger
Stettinerstraße 3+5
82110 Germering
+49-89-8941320
kreitinger@ers-gmbh.de
http://www.ers-gmbh.com

Pressekontakt
Brand+Image
Timothy Göbel
Von-Eichendorff-Str. 41
86911 Dießen a.A.
08807 9475642
ERS@brandandimage.de

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Electric Electronics

Dynamic Thermal Shield: Higher Throughput and More Reliable Results in Wafer Test

ERS at Semicon Japan 2015

Dynamic Thermal Shield: Higher Throughput and More Reliable Results in Wafer Test

MUNICH, December 2, 2015 – ERS electronic GmbH, technology leader in air-cooled chuck systems for semiconductor manufacturing, is announcing a technology break-through that significantly improves measurement precision during wafer test. ERS electronic“s new Dynamic Thermal Shield (DTS) helps semiconductor manufacturers to achieve better test results faster.

DTS is an add-on to ERS“ existing wafer chuck solutions that prevents unwanted thermal influence from the test procedure to adjacent components in the system, such as probe card or prober top plate. During the process, the test equipment heats up to temperatures in the range of 150 to 200°C or higher. The heat extends to close by components. This effect negatively impacts numerous relevant parameters such as mechanical precision or the electrical performance of the probe card. Available solutions to face this problem typically try to deal with the thermal effects, although with varying success. Going further than these solutions, DTS is the only system that addresses the root of heat distribution by preventing thermal changes to the neighboring components. The system detects thermal hot spots in the assembly caused by the moving chuck and then selectively applies cooling to these spots. This results in thermal stability of the whole test assembly; critical components such as probe card and head plate always remain at their optimum operating temperatures. In addition, the system avoids the typical „soak times“ and time-consuming realignments associated with existing solutions. Exemplary field studies have shown, that users can achieve up to 25 percent higher test throughput.

DTS can be integrated into most existing wafer test set-ups, including as field retrofits. Massive parallel testing though is an exception as there is limited space for shielding the probe card. In virtually all other semiconductor manufacturing segments, the DTS is a relevant option. Given typical test costs in this industry, return on investment can be achieved in less than a year.

DTS will be introduced at ERS electronic“s booth 2125 in Hall 2 at the Semicon Japan trade fair, taking place from December 16 through December 18 in Tokyo.

ERS electronic GmbH, based in Germering near Munich, has been producing innovative thermal test solutions for the semiconductor industry for 45 years. The company has gained an outstanding reputation in the sector, notably with its fast and accurate thermal chuck systems for test temperatures ranging from -65°C to +500°C for analytical, parameter-related and manufacturing tests. Today, thermal chuck systems developed by ERS in its product families AC3, AirCool©, AirCool© plus and PowerSense© are an integral component in all larger-sized wafer probers right across the chip industry.

Firmenkontakt
ERS electronic GmbH
Klemens Reitinger
Stettinerstraße 3+5
82110 Germering
+49-89-8941320
kreitinger@ers-gmbh.de
http://www.ers-gmbh.com

Pressekontakt
Brand+Image
Timothy Göbel
Kaagangerstr. 36
82279 Eching a.A.
08143 9926834
ERS@brandandimage.de
http://www.brandandimage.de

Elektronik Medien Kommunikation

Fairchild Semiconductor startet Produktion auf 8″ Wafer-Fertigungslinie in Korea

Fab produziert Energiemanagementlösungen für den weltweiten Markt

Fairchild Semiconductor startet Produktion auf 8" Wafer-Fertigungslinie in Korea

München – 9. Juli 2013 – Fairchild Semiconductor (NYSE: FCS), ein weltweit führender Anbieter von Halbleiterbausteinen für Leistungselektronik und mobile Produkte, nimmt seine 8″ Wafer-Fertigungslinie in Bucheon, Korea offiziell in Betrieb. Die neue Fab zeigt den Fokus des Unternehmens auf innovative Leistungshalbleiter-Lösungen. Sie ist eine Investition für bessere Qualität und die Reaktion auf das dynamische Marktumfeld.

Die Fab wurde früher als geplant fertiggestellt und startet am 1. Juli mit der Produktion. Die offizielle Eröffnungszeremonie findet am 10. Juli statt.

Die zusätzliche Fab in Korea verbessert Fairchilds Flexibilität und Wettbewerbsfähigkeit bei den Kosten der Supply Chain. Dadurch kann der hochdynamische Markt für mobile Endgeräte in Asien besser bedient werden. Zusätzlich baut Fairchild seine Führungsposition im Bereich energieeffizienter Elektronik, wie LED-Hintergrundbeleuchtung, LCD TVs und Haushaltsgeräte in der Region sowie weltweit aus.

„Diese 8″ Fab ist ein entscheidender Schritt in der Entwicklung von Fairchilds Supply Chain hin zu noch besseren Leistungshalbleitern“, sagt Ben Kang, Managing Director von Fairchild Korea. „Wir können unsere Kunden dadurch deutlich besser bedienen.“

„Seit dem Kauf des Standorts in Bucheon im Jahr 1999 hat Fairchild rund 800 Millionen US-Dollar in die koreanischen Werke investiert“, sagt Vijay Ullal, President und COO von Fairchild Semiconductor. „Die neue 8″ Fab unterstreicht unser Engagement für die Märkte in Korea und Asien sowie weltweit. Das Hochfahren der Fab verlief bislang problemlos und wir hoffen, dass wir unsere Kunden bald beliefern können.“

Durch die Schaffung neuer Arbeitsplätze ist die Fab auch ein Beitrag zur wirtschaftlichen Entwicklung der Region.

Zu den in dieser Fab produzierten Technologien gehören diskrete Hochvolt-Produkte für den schnell wachsenden Markt von energieeffizienten Leistungsmanagementanwendungen, wie Stromversorgung, Displays, Motorsteuerungen sowie industrielle Leistungs- und Beleuchtungsprodukte.

Über Fairchild Semiconductor:
Fairchild Semiconductor (NYSE: FCS) – weltweite Präsenz, lokale Unterstützung, clevere Ideen. Fairchild liefert energieeffiziente, einfach einsetzbare und wertsteigernde Halbleiter-Lösungen für Leistungselektronik und mobile Designs. Mit unserer Erfahrung in den Bereichen Leistungselektronik und Signalpfad unterstützen wir unsere Kunden bei der Differenzierung ihrer Produkte und der Lösung schwieriger technischer Herausforderungen.

Produkt- und Unternehmensvideos, Podcasts und unseren Blog finden Sie unter: http://www.fairchildsemi.com/engineeringconnections

Kontakt
Fairchild Semiconductor
Birgit Fuchs-Laine
Oskar-von-Miller-Str. 4e
82256 Fürstenfeldbruck
089-417761-13
fairchild@lucyturpin.com
http://www.fairchildsemi.com/

Pressekontakt:
Lucy Turpin Communications
Birgit Fuchs-Laine
Prinzregentenstr. 79
81675 München
089-417761-13
fairchild@lucyturpin.com
http://www.lucyturpin.com

Electric Electronics

ERS introduces high-end chiller at Semicon West

ERS introduces high-end chiller at Semicon West

ERS Electronic GmbH

MUNICH, 1 July, 2013 – ERS electronic GmbH, the innovation leader for thermal wafer chucks in semiconductor production, will introduce advanced chilling technology for its AirCool3 modular thermal chuck system at the Semicon West in San Francisco. The new technology will enable ERS AirCool system to be used on 450mm wafer chucks without loss of chilling power or increase in test floor footprint.

The stronger performance of the new chiller system stems from ERS“s 43-year experience in thermal test and specifically in a new electronics control circuitry that more fully exploits the chilling power of the standard refrigeration system at the core of the air-cooled system.

The new system will easily master the larger thermal mass of a 450mm chuck bringing the built-in economy, flexibility, compactness and unmatched reliability of the patented ERS AirCool plus thermal chuck technology.

„The introduction of the new system proves that ERS is ready for the 450mm transition in the semiconductor industry“, said ERS electronics General Manager Klemens Reitinger. „It not only enables users to perform checks in the full analytical temperature range but also offers the ability to drive peripheral components of the test cell.“

Beta versions of the new chiller system are already running in production at customer sites around the world. ERS factory manufacturing levels for chillers with this new technology will match current technology by the end of the year.

Semicon West will take place from July 9-11 at the Moscone Center, San Francisco, Calif. ERS can be found in the North Hall, Booth 6277.

For more information visit www.ers-gmbh.com

About ERS electronic GmbH:
ERS electronic GmbH, located near Munich, is for more than 40 years supplying the most innovative thermal test solutions to the semiconductor industry. The most famous products are its fast-ramping and precise low-noise thermal chuck systems (-65°C to +500°C) for analytical, parametric and wafer sort probing up to 300mm. ERS also designs and builds stand-alone thermal-forcing systems and custom production tools for special applications. ERS invented the AirCool®, AirCool® plus and PowerSense® thermal chuck systems that have been fully integrated into all major manual, semi- and fully automatic wafer probers.

Kontakt
ERS electronic GmbH
Klemens Reitinger
Stettinerstraße 3+5
82110 Germering
+49-89-8941320
kreitinger@ers-gmbh.de
http://www.ers-gmbh.com

Pressekontakt:
Brand+Image
Timothy Göbel
Kaagangerstr. 36
82279 Eching a.A.
08143 9926834
info@brandandimage.de
http://www.brandandimage.de

Electric Electronics

ERS displays its innovative product spectrum at PSECE 2013 trade fair

ERS displays its innovative product spectrum at PSECE 2013 trade fair

ERS Electronic GmbH

MUNICH, May 28, 2013 – ERS electronic GmbH, the innovation leader in the market of thermal wafer chucks in semiconductor production, will show its spectrum of wafer chuck systems at the Philippine Semiconductor and Electronics Convention and Exhibition (PSECE). In the spotlight of ERS‘ presence at the event is the innovative ERS AirCool3 modular chuck system.

During the event, which will take place from June 5 – 7, ERS electronic will speak on thermal testing of semiconductors at the wafer level. This presentation will draw from ERS“ 43 years of experience as equipment supplier to the semiconductor industry with an emphasis on hot/cold testing of semiconductors destined for automotive applications. The lecture will cover the advantages and disadvantages of various coolants leading to ERS“s decision to concentrate on air as the most reliable, flexible and cost-efficient cooling solution.

ERS will also officially announce that Harald Ibele, currently General Manager of ERS America, will lead ERS business in Asia focused on the Philippines in Manila. Manila was the logical choice for ERS based on the existing sales base at the test floors of several semiconductor manufacturers and the centralized location in the Asian high-tech region. „We are experiencing the strongest demand growth in Asia. Therefore it was the logical step to expand our presence here,“ commented ERS General Manager Klemens Reitinger.
By assuming the task of managing ERS‘ Asian activities, Harald Ibele takes on a new challenge after having successfully launched the company’s U.S. business. A seasoned expert in the field of wafer-level semiconductor testing, Ibele grew ERS‘ U.S. business to its current size.

ERS can be found at booth 123 at the PSECE fairground in the SMX Convention Center, Manila. The lecture will take place on stage 1, hall 1.

For more information visit www.ers-gmbh.com

About ERS electronic GmbH:
ERS electronic GmbH, located near Munich, is for more than 40 years supplying the most innovative thermal test solutions to the semiconductor industry. The most famous products are its fast-ramping and precise low-noise thermal chuck systems (-65°C to +500°C) for analytical, parametric and wafer sort probing up to 300mm. ERS also designs and builds stand-alone thermal-forcing systems and custom production tools for special applications. ERS invented the AirCool®, AirCool® plus and PowerSense® thermal chuck systems that have been fully integrated into all major manual, semi- and fully automatic wafer probers.

Kontakt
ERS electronic GmbH
Klemens Reitinger
Stettinerstraße 3+5
82110 Germering
+49-89-8941320
kreitinger@ers-gmbh.de
http://www.ers-gmbh.com

Pressekontakt:
Brand+Image
Timothy Göbel
Kaagangerstr. 36
82279 Eching a.A.
08143 9926834
info@brandandimage.de
http://www.brandandimage.de

Electric Electronics

ERS FOWLP Competence Center now supporting a growing and diverse advanced packaging market

ERS FOWLP Competence Center now supporting a growing and diverse advanced packaging market

MUNICH – December 5, 2012 – One and half a year after its launch, ERS electronic GmbH’s FOWLP (Fan-out Wafer Level Packaging) competence center near Munich (Germany) is being utilized by an increasing number of semiconductor chip makers, research institutes, materials suppliers and packaging sub-contractors. The ERS lab provides the opportunity to utilize ERS‘ latest tools for production processes associated with eWLB (embedded Wafer Level BGA) and other FOWLP applications. The applications now being supported by ERS tools and engineers are more diverse than ever – some even include processes normally covered by more conventional front end tools. This increased participation in new development projects and the corresponding use of the ERS competence center is particularly pronounced in the second half of 2012.

„We are more than pleased with the acceptance of our offering throughout the entire industry and around the world“, said Klemens Reitinger, Managing Director of ERS. „Besides being utilized by third parties and new customers it also strengthens the ties to our existing customer base.“

The competence center creates a win-win situation for both the partners it supports and for ERS electronic: While delivering access to its patented debonding and warpage control technology, ERS keeps itself informed on emerging customer technologies and requirements. This means that ERS has the information it needs to stay ahead of the curve and be in a position to design, develop and deliver FOWLP equipment for upcoming packaging processes in a timely way.

„No matter which direction the technological development goes, thermal processing will be strategic element present in all processes“, Reitinger said.

For further information visit http://www.ers-gmbh.com

About ERS electronic GmbH:
ERS electronic GmbH, located near Munich, is in its 40th year of supplying the most innovative thermal test solutions to the semiconductor industry. The most famous products are its fast-ramping and precise low-noise thermal chuck systems (-65°C to +500°C) for analytical, parametric and wafer sort probing up to 300mm. ERS also designs and builds stand-alone thermal-forcing systems and custom production tools for special applications. ERS invented the AirCool®, AirCool® plus and PowerSense® thermal chuck systems that have been fully integrated into all major manual, semi- and fully automatic wafer probers.

Kontakt:
ERS electronic GmbH
Klemens Reitinger
Stettinerstraße 3+5
82110 Germering
+49-89-8941320
kreitinger@ers-gmbh.de
http://www.ers-gmbh.com

Pressekontakt:
Brand+Image
Timothy Göbel
Kaagangerstr. 36
82279 Eching a.A.
08143 9926834
info@brandandimage.de
http://www.brandandimage.de

Computer Information Telecommunications

ERS AirCool 3 (AC3) systems certified according to international safety standards

ERS AirCool 3 (AC3) systems certified according to international safety standards

MUNICH – July 12, 2012 – ERS electronic GmbH, technology leader in the market for Thermal Wafer Chucks for use in semiconductor production, has announced today that its AirCool 3 wafer thermal test system has successfully passed all tests associated with the applicable safety standards from Underwriters Laboratories (UL), International Electrotechnical Commission (IEC) and Canadian Standards Association (CSA).

The tests, conducted by TÜV Süd (Munich, Germany) and TÜV Süd USA (Peabody, MA, USA) certify that the ERS models for thermal wafer test of 150mm, 200mm, and 300mm wafers as well as the ERS AC3 Package Level Product Line meet the strict safety requirements for laboratory equipment involved in the heating of materials. The equipment has been certified according to UL 61010-1:2004, IEC 61010-2-010:2003, CAN/CSA-C22.2 No. 61010-1:2004 and CAN/CSA-C22.2 No. 61010-2-010:2004. These certificates are required by end users of test equipment containing the ERS products in the semiconductor manufacturing industry worldwide.

„Our systems are renowned for their performance, reliability and flexibility in thermal wafer probing throughout the semiconductor industry“, said Klemens Reitinger, CEO of ERS electronic GmbH. „These TÜV certifications do not only confirm the high level of quality and safety designed into our products – to our knowledge, no other manufacturer of thermal chucks has all of these certifications for one product.“

Thermal wafer chuck systems are a strategic part of the semiconductor production. They enable manufacturers to perform electrical tests on the wafer before the ICs are separated and packaged. Devices that would fail later in the process can be removed before the devices undergo the expensive process of packaging, thereby saving considerable manufacturing costs. The system offers very small footprint – and in some cases essentially zero footprint – for the associated chilling unit plus the capability to test power-dissipating semiconductor devices. Since it uses air instead of a liquid coolant, the AirCool3 offers unmatched reliability and unbeatably low cost of ownership.

For further information visit www.ers-gmbh.com

About ERS electronic GmbH:
ERS electronic GmbH, located near Munich, has been providing the most innovative thermal test solutions to the semiconductor industry for over 40 years. The best known products are its fast-ramping and precise low-noise thermal chuck systems (-65°C to +500°C) for analytical, parametric and wafer sort probing up to 300mm. ERS also designs and builds stand-alone thermal-forcing systems and custom production tools for special applications. ERS invented the AirCool, AirCoolplus and PowerSense thermal chuck systems that have been fully integrated into all major manual, semi- and full automatic wafer probers.

Kontakt:
ERS electronic GmbH
Klemens Reitinger
Stettinerstraße 3+5
82110 Germering
+49-89-8941320
kreitinger@ers-gmbh.de
http://www.ers-gmbh.com

Pressekontakt:
Brand+Image
Timothy Göbel
Kaagangerstr. 36
82279 Eching a.A.
08143 9926834
ers@brandandimage.de
http://www.brandandimage.de