Tag Archives: semiconductor

Electric Electronics

ERS Competence Center celebrates fifth anniversary

High customer acceptance, rising number of application areas

ERS Competence Center celebrates fifth anniversary

(Source: ERS electronic GmbH)

MUNICH, September 27, 2016 – ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor production, looks back to five extraordinary successful years of operating its Fan-out Wafer Level Packaging (FOWL) test competence center in Munich. The center enjoys rising popularity among customers, fuelled not least by the second wave of the Advanced Packaging technology expansion that currently can be observed across the semiconductor industry.

„In retrospect, the decision to launch this Competence Center five years ago has been very fruitful and future-oriented“, says ERS Managing Director Klemens Reitinger. Though the technology has made significant progress, some fundamental issues persist – in particular those related to the proper separation of the reconstituted wafer from its temporary carrier as well as to workpiece warpage. „To both problems, we are offering solutions that can be tested in our Competence Center. Most of these solutions are based on our protected intellectual property“, Reitinger explains.

ERS observed that since 2015 the second wave of the Advanced Packaging Technology Expansion started to gain traction, triggering a significant increase in the number of market participants. OSATs (Outsourced Semiconductor Assembly and Test), material manufacturers, equipment vendors and research institutes alike are intensifying their activities in the area of embedded Wafer Level BGA (eWLB). Also, eWLB package manufacturing processes have evolved since the time the Competence Center has opened its doors. A diversity of materials and processes has unfolded. Metal, glass, silicon, diverse new potting compounds have entered the scene along with new process concepts like Chip First or RDL First. At the same time, the variety of end products and applications leveraging Advanced Packaging has grown substantially: Extremely slim smartphones, smart watches, IoT devices and even automotive products such as radar sensors are manufactured using Advanced Packaging, to name just a few examples.

The Competence Center is a significant contribution to ERS“ appeal as a leading vendor of manufacturing and development equipment. Mr. Reitinger describes the formula for success: „Strict confidentiality, no fees. Thus, we can remain open for the technological progress and can deliver results quickly and unbureaucratically.“ ERS“ reward: „Since our customers know they can trust us, we are aware of new technology trends at a very early stage. This enables us to integrate our solutions into products and manufacturing equipment more quickly.“

ERS electronic GmbH, based in Germering near Munich, has been producing innovative thermal test solutions for the semiconductor industry for 45 years. The company has gained an outstanding reputation in the sector, notably with its fast and accurate thermal chuck systems for test temperatures ranging from -65°C to +500°C for analytical, parameter-related and manufacturing tests. Today, thermal chuck systems developed by ERS in its product families AC3, AirCool©, AirCool© plus and PowerSense© are an integral component in all larger-sized wafer probers right across the chip industry.

Firmenkontakt
ERS electronic GmbH
Klemens Reitinger
Stettinerstraße 3+5
82110 Germering
+49-89-8941320
kreitinger@ers-gmbh.de
http://www.ers-gmbh.com

Pressekontakt
Brand+Image
Timothy Göbel
Von-Eichendorff-Str. 41
86911 Dießen a.A.
08807 9475642
ERS@brandandimage.de

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Electric Electronics

ERS showcases Thermal Chuck and eWLB Test Product Line-up at Semicon Taiwan

Semicon Taiwan: Booth 2522, 1st floor

ERS showcases Thermal Chuck and eWLB Test Product Line-up at Semicon Taiwan

(Source: ERS electronic GmbH)

MUNICH, September 1, 2016 – ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor production, will showcase its product line at the Semicon Taiwan trade fair (September 7 – 9). At the exhibition, ERS shares its stand with its sales partner Chain Logic International Corp. (CLIC), highlighting the trusting and fruitful cooperation between ERS and CLIC.

ERS Asia General Manager Harald Ibele will be attending the event on behalf of ERS and is available to meet for any questions regarding wafer probe or eWLB style warpage adjust equipment and processes. „This joint exhibition presence highlights the trusting and fruitful cooperation between ERS and CLIC“, said Ibele. „With the proven quality of our products and services we will continue our successful relationship.“

ERS excels in high accuracy, low noise thermal chucks for high-end wafer test for technologically demanding segments of the semiconductor industry such as the automotive, medical and aerospace markets as well as R&D.

Semicon Taiwan is the premiere event for the semiconductor industry in Asia, bringing together manufacturers, suppliers and business customers from all over the world. Taiwan is known for having the largest concentration of foundries and test houses globally. With its current line-up of technologically advanced test solutions, ERS, together with its distribution partner Chain Logic, is extremely well positioned to break into this demanding market. ERS“ latest developments in the field of Thermal Wafer Chucks will take center stage at the company“s exhibits in booth 2522, 1st floor.

Semicon Taiwan, one of the largest events of its kind around the globe, is expected to attract 43.000 visitors and 3.300 program participants; more than 700 exhibitors from all over the world will showcase their products in 1600+ booths.

ERS electronic GmbH, based in Germering near Munich, has been producing innovative thermal test solutions for the semiconductor industry for 45 years. The company has gained an outstanding reputation in the sector, notably with its fast and accurate thermal chuck systems for test temperatures ranging from -65°C to +500°C for analytical, parameter-related and manufacturing tests. Today, thermal chuck systems developed by ERS in its product families AC3, AirCool©, AirCool© plus and PowerSense© are an integral component in all larger-sized wafer probers right across the chip industry.

Firmenkontakt
ERS electronic GmbH
Klemens Reitinger
Stettinerstraße 3+5
82110 Germering
+49-89-8941320
kreitinger@ers-gmbh.de
http://www.ers-gmbh.com

Pressekontakt
Brand+Image
Timothy Göbel
Von-Eichendorff-Str. 41
86911 Dießen a.A.
08807 9475642
ERS@brandandimage.de

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Electric Electronics

Dynamic Thermal Shield: Higher Throughput and More Reliable Results in Wafer Test

ERS at Semicon Japan 2015

Dynamic Thermal Shield: Higher Throughput and More Reliable Results in Wafer Test

MUNICH, December 2, 2015 – ERS electronic GmbH, technology leader in air-cooled chuck systems for semiconductor manufacturing, is announcing a technology break-through that significantly improves measurement precision during wafer test. ERS electronic“s new Dynamic Thermal Shield (DTS) helps semiconductor manufacturers to achieve better test results faster.

DTS is an add-on to ERS“ existing wafer chuck solutions that prevents unwanted thermal influence from the test procedure to adjacent components in the system, such as probe card or prober top plate. During the process, the test equipment heats up to temperatures in the range of 150 to 200°C or higher. The heat extends to close by components. This effect negatively impacts numerous relevant parameters such as mechanical precision or the electrical performance of the probe card. Available solutions to face this problem typically try to deal with the thermal effects, although with varying success. Going further than these solutions, DTS is the only system that addresses the root of heat distribution by preventing thermal changes to the neighboring components. The system detects thermal hot spots in the assembly caused by the moving chuck and then selectively applies cooling to these spots. This results in thermal stability of the whole test assembly; critical components such as probe card and head plate always remain at their optimum operating temperatures. In addition, the system avoids the typical „soak times“ and time-consuming realignments associated with existing solutions. Exemplary field studies have shown, that users can achieve up to 25 percent higher test throughput.

DTS can be integrated into most existing wafer test set-ups, including as field retrofits. Massive parallel testing though is an exception as there is limited space for shielding the probe card. In virtually all other semiconductor manufacturing segments, the DTS is a relevant option. Given typical test costs in this industry, return on investment can be achieved in less than a year.

DTS will be introduced at ERS electronic“s booth 2125 in Hall 2 at the Semicon Japan trade fair, taking place from December 16 through December 18 in Tokyo.

ERS electronic GmbH, based in Germering near Munich, has been producing innovative thermal test solutions for the semiconductor industry for 45 years. The company has gained an outstanding reputation in the sector, notably with its fast and accurate thermal chuck systems for test temperatures ranging from -65°C to +500°C for analytical, parameter-related and manufacturing tests. Today, thermal chuck systems developed by ERS in its product families AC3, AirCool©, AirCool© plus and PowerSense© are an integral component in all larger-sized wafer probers right across the chip industry.

Firmenkontakt
ERS electronic GmbH
Klemens Reitinger
Stettinerstraße 3+5
82110 Germering
+49-89-8941320
kreitinger@ers-gmbh.de
http://www.ers-gmbh.com

Pressekontakt
Brand+Image
Timothy Göbel
Kaagangerstr. 36
82279 Eching a.A.
08143 9926834
ERS@brandandimage.de
http://www.brandandimage.de

Electric Electronics

Fujitsu Semiconductor and Rohde & Schwarz Extend Long-Standing Cooperation for Customized SoCs

Parties signed contract for development of a 28nm System on Chip for Rohde & Schwarz test and measurement instruments

Fujitsu Semiconductor and Rohde & Schwarz Extend Long-Standing Cooperation for Customized SoCs

Fujitsu Semiconductor and Rohde & Schwarz extend long-standing cooperation.

Langen & Munich, Germany, February 16, 2015 – Fujitsu Semiconductor Europe (FSEU) and Rohde & Schwarz (R&S) signed a contract to extend their long-standing cooperation. The partnership will focus on developing a customized System on Chip (SoC) using a production technology of 28nm. This SoC will be used in Rohde & Schwarz test and measurement instruments. FSEU“s expertise in the area of leading semiconductor design, especially in the area of application-specific integrated circuits (ASICs) is the foundation of this long-standing partnership of more than ten years.

Roland Steffen, Executive Vice President and Head of Test and Measurement Division at Rohde & Schwarz, comments: „Our instruments and test systems set new standards in research, development, production and service worldwide. To keep and develop this position we need a strong and reliable technology partner. In FSEU we found such a partner who has proven its expertise and capabilities in developing state-of-the-art ASICs tailored to our needs and those of our customers.“

Brendan Mc Kearney, President at Fujitsu Semiconductor Europe, states: „FSEU is proud to be part of this sophisticated high end technology co development project. Our team of dedicated design and implementation engineers will work closely together with Rohde & Schwarz to leverage FSEU“s ASIC expertise and experience and bring an industry-leading test and measurement platform to life.“

Über Fujitsu Semiconductor Europe (FSEU)

Seit 1980 bedient Fujitsu Semiconductor Europe (FSEU) die Märkte Automotive, Industrial, Communications und Home Entertainment. Das Unternehmen mit Hauptsitz in Langen bei Frankfurt ist einer der wichtigsten Zulieferer von \\\\\\\“Right-Sized\\\\\\\“ und fortschrittlichen Halbleiterlösungen. Mit dieser Vision entwickelt FSEU nicht nur maßgeschneiderte Produkte für modernste Anwendungen, sondern bietet über seine Niederlassungen in ganz Europa und die eigene Software-Tochter (FEAT) im österreichischen Linz ausgezeichnete technische Dienstleistungen und Unterstützung an. FSEU hat das Ziel, ein integraler Bestandteil in der Lieferkette seiner Kunden zu sein. In den Design-Zentren sowie Forschungs- und Entwicklungseinrichtungen von Fujitsu, die sich analoger und Mixed-Signal-Technologie, Advanced Packaging, Grafikcontrollern, Multimedia ICs, kundenspezifischen SoCs (ASICs) und Embedded Software widmen, arbeiten die Ingenieure von FSEU eng mit den Marketing- und Vertriebsteams der Kunden in der EMEA-Region zusammen, um den Anforderungen der Kunden an deren Systementwicklung gerecht zu werden.

Unternehmenswebsite: http://emea.fujitsu.com/semiconductor
Newsletter: http://emea.fujitsu.com/newsletter
Twitter: http://emea.fujitsu.com/twitter

Firmenkontakt
Fujitsu Semiconductor Europe GmbH
Mark Ellins
Pittlerstr. 47
63225 Langen
06103-6900
mark.ellins@de.fujitsu.com
http://emea.fujitsu.com/semiconductor

Pressekontakt
Hotwire
Florian Hohenauer
Franziska-Bilek-Weg 9
80339 München
+49 (0)89 210932-74
florian.hohenauer@hotwirepr.com
http://www.hotwirepr.com

Elektronik Medien Kommunikation

Fujitsu stellt Ultra-Low-Power-FRAM mit integrierter Zählerfunktion vor

Perfekt abgestimmt auf Sensor- und Energy-Harvesting-Anwendungen in der Industrieautomation

Fujitsu stellt Ultra-Low-Power-FRAM mit integrierter Zählerfunktion vor

Fujitsu stellt Ultra-Low-Power-FRAM mit integrierter Zählerfunktion vor.

Langen, Deutschland, 9. Dezember 2014 – Fujitsu Semiconductor Europe (FSEU) stellt heute den neuen FRAM-Baustein MB85RDP16LX vor, der extrem stromsparend arbeitet und mit einem integrierten Binärzähler ausgestattet ist. Das neue Produkt überzeugt mit zahlreichen Optimierungen: Verglichen mit Standard-FRAM-Lösungen liegt die Energieaufnahme des neuen Bausteins bei weniger als zehn Prozent. Mit MB85RDP16LX zielt Fujitsu auf Energy-Harvesting-Anwendungen in der Industrieautomation, beispielsweise für Drehgeber, Motorsteuerungen und Sensoren. Mit dem extrem stromsparenden Produkt lassen sich energieautarke Lösungen wie etwa die von iC-Haus angebotene Wiegand wire-based platform realisieren.

Wesentliche Energieeinsparungen werden durch die Integration der Zählerfunktion in den FRAM-Chip erreicht. In herkömmlichen Systemumgebungen mit Standardspeicher muss die MCU für einen Zählvorgang zunächst Daten aus dem Speicher auslesen, intern berechnen und schließlich die neuen Daten in den Speicher zurückschreiben. Beim MB85RDP16LX-Baustein dagegen werden die separaten Lese-/Schreibvorgänge durch einen einzigen MCU-Befehl ersetzt, was eine Energieeinsparung von bis zu 94 Prozent bewirkt.

Die Einschaltzeit des MB85RDP16LX-Bausteins wurde auf 5 Mikrosekunden optimiert – das ist 38-mal schneller als der Vergleichswert bei Standard-FRAM-Chips. Somit werden extrem schnelle Wake-up-Zeiten möglich, was wiederum mehr Energie einspart.

Der MB85RDP16LX-Baustein kann über Single- und Dual-SPI-Schnittstellen angesteuert werden. Die Dual-SPI-Schnittstelle ermöglicht die Halbierung der Taktfrequenz und eröffnet damit weiteres Energiesparpotenzial ohne jede Leistungseinbuße.

Um die Anforderungen der Industrieautomation an einen breiteren Temperaturbereich zu erfüllen, wurde der MB85RDP16LX-Baustein auf den Einsatz zwischen -40 und +105 Grad Celsius ausgelegt. Der Datenerhalt liegt weiterhin unverändert bei zehn Jahren.

MB85RDP16LX wird im SON-8-Gehäuse geliefert. Die Abmessungen von 2 mm x 3 mm ermöglichen den Entwurf von Kleinstgeräten. Im Vergleich zu herkömmlichen SOP-8-Gehäusen kann beim Speicher bis zu 80 Prozent an Leiterplattenplatz eingespart werden.
Verfügbarkeit

Die Massenproduktion von MB85RDP16LX hat bereits begonnen. Produktmuster sind ab sofort verfügbar.

Über Fujitsu Semiconductor Europe (FSEU)

Seit 1980 bedient Fujitsu Semiconductor Europe (FSEU) die Märkte Automotive, Industrial, Communications und Home Entertainment. Das Unternehmen mit Hauptsitz in Langen bei Frankfurt ist einer der wichtigsten Zulieferer von \\\“Right-Sized\\\“ und fortschrittlichen Halbleiterlösungen. Mit dieser Vision entwickelt FSEU nicht nur maßgeschneiderte Produkte für modernste Anwendungen, sondern bietet über seine Niederlassungen in ganz Europa und die eigene Software-Tochter (FEAT) im österreichischen Linz ausgezeichnete technische Dienstleistungen und Unterstützung an. FSEU hat das Ziel, ein integraler Bestandteil in der Lieferkette seiner Kunden zu sein. In den Design-Zentren sowie Forschungs- und Entwicklungseinrichtungen von Fujitsu, die sich analoger und Mixed-Signal-Technologie, Advanced Packaging, Grafikcontrollern, Multimedia ICs, kundenspezifischen SoCs (ASICs) und Embedded Software widmen, arbeiten die Ingenieure von FSEU eng mit den Marketing- und Vertriebsteams der Kunden in der EMEA-Region zusammen, um den Anforderungen der Kunden an deren Systementwicklung gerecht zu werden.

Unternehmenswebsite: http://emea.fujitsu.com/semiconductor
Newsletter: http://emea.fujitsu.com/newsletter
Twitter: http://emea.fujitsu.com/twitter

Firmenkontakt
Fujitsu Semiconductor Europe GmbH
Mark Ellins
Pittlerstr. 47
63225 Langen
06103-6900
mark.ellins@de.fujitsu.com
http://emea.fujitsu.com/semiconductor

Pressekontakt
Hotwire
Florian Hohenauer
Franziska-Bilek-Weg 9
80339 München
+49 (0)89 210932-74
florian.hohenauer@hotwirepr.com
http://www.hotwirepr.com

Business Economy Finances

New Clevios(TM) hardcoat – Up to Scratch

New Clevios(TM) PEDOT:PSS hardcoat at the Printed Electronics Show, Santa Clara, California.

Advanced electronic materials play a key role in touch panel technologies, such as projective capacitive touch screens (PCTs) and sensors, as well as in printed electronics applications. Heraeus, the leading producer of Clevios(TM) PEDOT:PSS (http://heraeus-clevios.com) conductive polymers, is to introduce a two component hardcoat lacquer which enables coatings of enhanced mechanical stability on a broad range of substrates.

On Plastic Solution

Scratch and chemical resistance are key factors in many functional substrates used in electronic devices. A new Clevios(TM) two component hardcoat formulation, which allows films of high rub and solvent (ethanol and acetone) resistance, along with pencil hardness of 6-8H, broadens the existing product portfolio. This two component lacquer provides sheet resistance of up to 170 Ohm/sq., transmission of about 90% (including PET substrate) and a haze of 0.6%. Where scratch resistance is critical Clevios(TM) provides the „on plastic solution“ whilst maintaining the flexibility of the film. Key applications include plastics, cover glass and touch panels. The two component hardcoat lacquer is marketed under the names Clevios(TM) F DX-2 and XL.

The Clevios(TM) PEDOT:PSS range from the Display & Semiconductor Business Unit comprises of solutions for antistatic to highly conductive coatings. Products are tailored for their application method and specific end use. Clevios(TM) based coatings are increasingly used in touch panels and sensors, as well as OLEDs, and 3rd generation solar cells.

The Hanau-based precious metal and technology group Heraeus is a globally active family-run enterprise with a history of more than 160 years. We provide high-end solutions to our customers to lastingly strengthen their competitive position. Our areas of competence include precious metals, materials and technologies, sensors, biomaterials and medical devices, quartz glass and specialty light sources. In the financial year 2013, Heraeus achieved a revenue from the sale of products of EUR3.6 bn, while the revenue from precious metal trading was EUR13.5 bn. With about 12,500 employees in more than 110 companies world-wide, Heraeus is in a leading position on its global sales markets.

Firmenkontakt
Heraeus Precious Metals
John Bayley
CHEMPARK
51368 Leverkusen
123
john.Bayley@heraeus.com
http://www.heraeus-clevios.com/

Pressekontakt
Heraeus Precious Metals GmbH & Co. KG
John Bayley
CHEMPARK
51368 Leverkusen, Germany
+49 214 30 26718
john.bayley@heraeus.com
http://www.heraeus-clevios.com

Electric Electronics

Photokina 2014: Leica and Fujitsu Semiconductor Extend Long-Standing Cooperation Focusing on Next Generation SoC

Photokina 2014: Leica and Fujitsu Semiconductor Extend Long-Standing Cooperation Focusing on Next Generation SoC

Leica and Fujitsu Semiconductor sign letter of intent on photokina 2014 to extend cooperation.

Parties sign letter of intent on photo trade fair, will extend longstanding development relationship

Langen, Germany, September 18, 2014 – Leica Camera AG („Leica“) and Fujitsu Semiconductor Europe (FSEU) today signed a letter of intent, expressing their plans to extend their longstanding cooperation. The partnership will focus on developing next generation System on Chips (SoC) for Leica“s leading-edge digital cameras for professional use. FSEU“s expertise in the area of leading semiconductor design, and especially in the area of digital camera image processor SoC, already resulted in the successful development of two generations of Camera SOCs.

Both companies have an ongoing cooperation since 2008. At Photokina 2014, they presented its latest result, a new Leica S camera that features the Leica MAESTRO II image processor. Small medium-format cameras such as the Leica S-System offer excellent imaging quality and user experiences due to the high-definition imagery, fast processing speeds, and low power consumption that the Fujitsu Milbeaut series of image processing devices for cameras is able to provide.

Markus Limberger, Chief Operating Officer in the Leica Camera board, comments: „In FSEU, we have found a strong and reliable technology partner who has proven its expertise and capabilities for state-of-the-art imaging solutions over the years in the context of our cooperation. We are highly committed on fostering this relationship. As expressed in the letter of intent, Leica will, subject to availability and commercial and technological fit, solely use FSEU products of this type of SoC for its professional camera solutions.“

Inoue Amane, Corporate Senior Vice President and President of System LSI Company at Fujitsu Semiconductor Limited comments: „FSEU will fully support Leica“s requirements while developing the next generation SoC Maestro III and respective firmware. Our team of dedicated hardware and software engineers will continue merging the strengths of FSEU“s image-processing technologies with Leica“s high-definition imaging technologies and offer an industry-leading image processing solution.“ By signing the letter of intent, FSEU also commits on using a production technology of 28nm or better for future developments and providing samples to Leica as early as possible, allowing Leica a quick development.

Über Fujitsu Semiconductor Europe (FSEU)

Seit 1980 bedient Fujitsu Semiconductor Europe (FSEU) die Märkte Automotive, Industrial, Communications und Home Entertainment. Das Unternehmen mit Hauptsitz in Langen bei Frankfurt ist einer der wichtigsten Zulieferer von „Right-Sized“ und fortschrittlichen Halbleiterlösungen. Mit dieser Vision entwickelt FSEU nicht nur maßgeschneiderte Produkte für modernste Anwendungen, sondern bietet über seine Niederlassungen in ganz Europa und die eigene Software-Tochter (FEAT) im österreichischen Linz ausgezeichnete technische Dienstleistungen und Unterstützung an. FSEU hat das Ziel, ein integraler Bestandteil in der Lieferkette seiner Kunden zu sein. In den Design-Zentren sowie Forschungs- und Entwicklungseinrichtungen von Fujitsu, die sich analoger und Mixed-Signal-Technologie, Advanced Packaging, Grafikcontrollern, Multimedia ICs, kundenspezifischen SoCs (ASICs) und Embedded Software widmen, arbeiten die Ingenieure von FSEU eng mit den Marketing- und Vertriebsteams der Kunden in der EMEA-Region zusammen, um den Anforderungen der Kunden an deren Systementwicklung gerecht zu werden.

Unternehmenswebsite: http://emea.fujitsu.com/semiconductor
Newsletter: http://emea.fujitsu.com/newsletter
Twitter: http://emea.fujitsu.com/twitter

Firmenkontakt
Fujitsu Semiconductor Europe GmbH
Herr Mark Ellins
Pittlerstr. 47
63225 Langen
06103-6900
mark.ellins@de.fujitsu.com
http://emea.fujitsu.com/semiconductor

Pressekontakt
Hotwire
Florian Hohenauer
Franziska-Bilek-Weg 9
80339 München
+49 (0)89 210932-74
florian.hohenauer@hotwirepr.com
http://www.hotwirepr.com

Electric Electronics

Photokina 2014: Leica to Present New High-End Camera Leica S Featuring Leica MAESTRO II Processor built on Fujitsu Technology

Photokina 2014: Leica to Present New High-End Camera Leica S Featuring Leica MAESTRO II Processor built on Fujitsu Technology

Leica to present new Leica S high-end camera featuring Leica MAESTRO II image processor at Photokina

Joint presence at leading photo trade fair from September 16 – 21, 2014, underscores longstanding development relationship

Langen, Germany, September 16, 2014 – Leica Camera AG („Leica“) and Fujitsu Semiconductor Europe (FSEU) will be presenting a new Leica S camera that features the Leica MAESTRO II image processor at the Photokina exhibition to be held in Cologne, Germany, from September 16 – 21 (booth A002, hall 01.1). The Leica S-System is a purely digital high-end camera system built for professional photographers. Small medium-format cameras offer excellent imaging quality and user experiences due to the high-definition imagery, fast processing speeds, and low power consumption that the Fujitsu Milbeaut series of image processing devices for cameras is able to provide.

Leica MAESTRO II has been built upon the latest technology from Fujitsu“s Milbeaut series. It features improved image processing algorithms and faster CPUs. The combined faster operation of both software and hardware enables superior image processing performance.

The joint presence at Photokina underscores the longstanding and successful relationship between Leica and FSEU.

Fujitsu Milbeaut series
Due to increasingly higher requirements with respect to image quality, demand for faster image processing systems, which at the same time guarantee low power consumption, continues to grow. Widely used in digital single-lens reflex (SLR), compact digital still, and mobile phone cameras, the Milbeaut series meets current market demands. Fujitsu Milbeaut technology offers various image processing and interface functions on a single chip as required by these cameras, including video and audio support.

Dr. Volker Zimmer, Head of the Digital Imaging Division of Leica, commented, „Leica delivers cutting-edge technology to professional photographers around the world. Therefore, we rely on strong technology partners such as Fujitsu who provide us with state-of-the-art imaging solutions. MAESTRO II will deliver excellent performance for our key customers.“

Strategic cooperation
In 2008, Leica and FSEU introduced a co-developed image processing system solution for high-end digital SLR cameras to be featured in Leica“s next generation cameras. For this joint development, Leica and FSEU established a team of dedicated hardware and software engineers to leverage the company“s expertise and know-how. By combining the strengths of FSEU“s image-processing Milbeaut technologies with Leica“s high-definition imaging technologies, the companies offer an industry-leading image processing solution that is also featured in the new Leica S.

„Solutions like the Leica MAESTRO II image processor presented at Photokina are the result of a long-standing development partnership with Leica,“ said Markus Mierse, Senior Director of the Imaging Business Unit of FSEU. „We will be building on this successful cooperation to keep delivering outstanding high-end cameras that combine Leica“s expertise and reputation in the camera industry with our Milbeaut image processing LSI technology.“

About Leica Camera
Leica Camera AG is an internationally operating, premium-segment manufacturer of cameras and sport optics products. The legendary status of the Leica brand is founded on a long tradition of excellence in the construction of lenses. Combined with innovative technologies, Leica products continue to guarantee better pictures in all situations in the worlds of visualisation and perception to this day. Leica Camera AG has its headquarters in Wetzlar, in the state of Hesse in Germany, and a second production site in Vila Nova de Famalicão, Portugal. The company operates branch offices in England, France, Japan, Singapore, Switzerland, South Korea, Italy, Australia and the USA. New and innovative products have been the driving force behind the company’s positive development in recent years. For more information, please see: http://en.leica-camera.com/home/

Über Fujitsu Semiconductor Europe (FSEU)

Seit 1980 bedient Fujitsu Semiconductor Europe (FSEU) die Märkte Automotive, Industrial, Communications und Home Entertainment. Das Unternehmen mit Hauptsitz in Langen bei Frankfurt ist einer der wichtigsten Zulieferer von ‘Right-Sized’ und fortschrittlichen Halbleiterlösungen. Mit dieser Vision entwickelt FSEU nicht nur maßgeschneiderte Produkte für modernste Anwendungen, sondern bietet über seine Niederlassungen in ganz Europa und die eigene Software-Tochter (FEAT) im österreichischen Linz ausgezeichnete technische Dienstleistungen und Unterstützung an. FSEU hat das Ziel, ein integraler Bestandteil in der Lieferkette seiner Kunden zu sein. In den Design-Zentren sowie Forschungs- und Entwicklungseinrichtungen von Fujitsu, die sich analoger und Mixed-Signal-Technologie, Advanced Packaging, Grafikcontrollern, Multimedia ICs, kundenspezifischen SoCs (ASICs) und Embedded Software widmen, arbeiten die Ingenieure von FSEU eng mit den Marketing- und Vertriebsteams der Kunden in der EMEA-Region zusammen, um den Anforderungen der Kunden an deren Systementwicklung gerecht zu werden.

Unternehmenswebsite: http://emea.fujitsu.com/semiconductor
Newsletter: http://emea.fujitsu.com/newsletter
Twitter: http://emea.fujitsu.com/twitter

Firmenkontakt
Fujitsu Semiconductor Europe GmbH
Herr Mark Ellins
Pittlerstr. 47
63225 Langen
06103-6900
mark.ellins@de.fujitsu.com
http://emea.fujitsu.com/semiconductor

Pressekontakt
Hotwire
Florian Hohenauer
Franziska-Bilek-Weg 9
80339 München
+49 (0)89 210932-74
florian.hohenauer@hotwirepr.com
http://www.hotwirepr.com

Elektronik Medien Kommunikation

Fujitsu stellt SoC-Baustein für die HEVC-HD-Decodierung in Multimedia-Anwendungen vor

Das SoC unterstützt H.265-Decodierung für Set-Top-Boxen und In-Car-Infotainmentsysteme

Fujitsu stellt SoC-Baustein für die HEVC-HD-Decodierung in Multimedia-Anwendungen vor

Fujitsu stellt SoC-Baustein für die HEVC-HD-Decodierung (H.265) für Multimedia-Anwendungen vor.

Langen, 26. August 2014 – Fujitsu Semiconductor Europe (FSEU) stellt mit dem MB8AL2030 – Rufname HD62 – eine aktuelle Erweiterung der H6x-Decoderserie vor. Das System on Chip (SoC) unterstützt die HEVC-Decodierung, auch bekannt als H.265-Decodierung, in HD-Auflösung für Multimedia-Anwendungen in In-Car-Infotainment- und Home-Entertainment-Systeme. H.265 ist der Nachfolger des weit verbreiteten Videostandards H.264. Mit H.265 lässt sich die Komprimierung im Vergleich zum Vorgänger noch einmal verdoppeln.

HD62 bietet zudem einen H.264-Encoder und unterstützt eine 3D-Grafik-Engine, mit der die 2D/3D-OSD-Generierung, Vektorgrafiken, hochwertiges Anti-Aliasing und Videoeffekte beschleunigt werden. Der Baustein auf Basis des ARM® Cortex™ A5 Quad-Core-Prozessors wird mit umfassenden Sicherheitsfunktionen zum Schutz von Inhalten gegen Piraterie geliefert, wie beispielsweise DVB-Entschlüsselung, DTCP, geschützter Programmstart und OTP zur Speicherung geheimer Schlüssel. Die äußerst geringe Leistungsaufnahme – in der Regel 2 Watt – prädestiniert den HD62 für den Einsatz in der Verbraucherelektronik, beispielsweise in hybriden Set-Top-Boxen für TV-Übertragungen und Streaming, DVB-T2-Set-Top-Boxen und Heimnetzwerken.

Das Kind einer globalen Entwicklungsumgebung

Das HD62-SoC wurde im ASIC Competence Center von FSEU in Langen bei Frankfurt entwickelt. Hier konnten alle Vorteile des Entwicklungssystems von Fujitsu für kundenspezifische System on Chips genutzt werden. Das Entwicklungssystem integriert hochmoderne Implementierungs- und Produktionstechniken, die über Jahre hinweg mit ASICs, Designdiensten und Entwicklungswerkzeugen gepflegt und ausgebaut wurden. Fujitsu produziert das SoC mit 55-nm-Prozesstechnologie in Japan in seinem Werk in der Präfektur Mie. Geliefert wird das Produkt im PBGA-484- Gehäuse.

Verfügbarkeit

Produktmuster aus der MB8AL2030-Serie, auch als HD62 bekannt, sind seit April 2014 verfügbar. Die Serienfertigung beginnt im ersten Quartal 2015.

Über Fujitsu Semiconductor Europe (FSEU)

Fujitsu Semiconductor Europe ist einer der wichtigsten Zulieferer von „Right-Sized“ und fortschrittlichen Halbleiterlösungen. Das Unternehmen mit Hauptsitz in Langen bei Frankfurt am Main bedient die Märkte Automotive, Industrial, Communications und Home Entertainment. Die „Right-Sized“-Strategie von FSEU ist darauf ausgerichtet, Kunden maßgeschneiderte Lösungen und eine höchstmögliche Wertschöpfungstiefe bieten zu können. Ingenieure der europäischen Design-Zentren sowie Forschungs- und Entwicklungseinrichtungen von Fujitsu, die sich analoger und Mixed-Signal-Technologie, Advanced Packaging, Mikrocontrollern, Grafikcontrollern, Multimedia ICs, ASICs und Embedded Software widmen, arbeiten eng mit Marketing- und Vertriebsteams in der EMEA-Region zusammen, um den Anforderungen der Kunden an deren Systementwicklung gerecht zu werden. FSEU-Teams stehen Kunden in Langen, München, Maidenhead bei London, Paris, Mailand, Budapest, Istanbul und Linz, Österreich mit technischem und anwendungsorientiertem Support zur Seite.

Unternehmenswebsite: http://emea.fujitsu.com/semiconductor
Newsletter: http://emea.fujitsu.com/newsletter
Twitter: http://emea.fujitsu.com/twitter

Firmenkontakt
Fujitsu Semiconductor Europe GmbH
Herr Mark Ellins
Pittlerstr. 47
63225 Langen
06103-6900
mark.ellins@de.fujitsu.com
http://emea.fujitsu.com/semiconductor

Pressekontakt
Hotwire
Florian Hohenauer
Franziska-Bilek-Weg 9
80339 München
+49 (0)89 210932-74
florian.hohenauer@hotwirepr.com
http://www.hotwirepr.com

Electric Electronics

Fujitsu Presents HEVC HD Decoding SoC for Multimedia Applications

Fujitsu Presents HEVC HD Decoding SoC for Multimedia Applications

Fujitsu presents the HEVC HD (H.265) decoding SoC for multimedia applications.

SoC supports H.265 decoding for set top boxes and in-car infotainment systems

Langen, Germany, August 26, 2014 – Fujitsu Semiconductor Europe (FSEU) today introduced its newest addition to the Fujitsu H6x decoder series: the MB8AL2030 nicknamed HD62. The System on Chip (SoC) supports HEVC (H.265) decoding in HD resolution for multimedia applications in in-car infotainment and home entertainment systems. H.265 is the successor to the widely used H.264, offering double the data compression ratio compared to its predecessor.

HD62 also includes an H.264 encoder and supports a 3D graphics engine to accelerate 2D/3D OSD generation, vector graphics, high-quality anti-aliasing and video effects. It comes with comprehensive security features for content protection including DVB descrambling, DTCP, secure boot and OTP to store secure keys, and builds on an ARM® Cortex™ A5 quad-core. It offers a very low power consumption, typically 2W, which makes it ideal for use in consumer electronics such as hybrid set-top boxes for broadcasting and streaming, DVB-T2 set-top boxes and home networking.

Leveraging a global development environment

The HD62 SoC was developed in FSEU“s ASIC Competence Centre in Langen, Germany, by leveraging Fujitsu“s development system for custom System on Chips, which integrates advanced device implementation and manufacturing techniques cultivated through years of experience with ASICs, design services, and development tool kits. The SoC is produced using 55nm process technology in Fujitsu“s Mie plant in Japan and comes in PBGA-484 packaging

Availability

Sample quantities of MB8AL2030, otherwise known as HD62, have been available since April 2014. Volume production will start in the first quarter of 2015.

Über Fujitsu Semiconductor Europe (FSEU)

Fujitsu Semiconductor Europe ist einer der wichtigsten Zulieferer von „Right-Sized“ und fortschrittlichen Halbleiterlösungen. Das Unternehmen mit Hauptsitz in Langen bei Frankfurt am Main bedient die Märkte Automotive, Industrial, Communications und Home Entertainment. Die „Right-Sized“-Strategie von FSEU ist darauf ausgerichtet, Kunden maßgeschneiderte Lösungen und eine höchstmögliche Wertschöpfungstiefe bieten zu können. Ingenieure der europäischen Design-Zentren sowie Forschungs- und Entwicklungseinrichtungen von Fujitsu, die sich analoger und Mixed-Signal-Technologie, Advanced Packaging, Mikrocontrollern, Grafikcontrollern, Multimedia ICs, ASICs und Embedded Software widmen, arbeiten eng mit Marketing- und Vertriebsteams in der EMEA-Region zusammen, um den Anforderungen der Kunden an deren Systementwicklung gerecht zu werden. FSEU-Teams stehen Kunden in Langen, München, Maidenhead bei London, Paris, Mailand, Budapest, Istanbul und Linz, Österreich mit technischem und anwendungsorientiertem Support zur Seite.

Unternehmenswebsite: http://emea.fujitsu.com/semiconductor
Newsletter: http://emea.fujitsu.com/newsletter
Twitter: http://emea.fujitsu.com/twitter

Firmenkontakt
Fujitsu Semiconductor Europe GmbH
Herr Mark Ellins
Pittlerstr. 47
63225 Langen
06103-6900
mark.ellins@de.fujitsu.com
http://emea.fujitsu.com/semiconductor

Pressekontakt
Hotwire
Florian Hohenauer
Franziska-Bilek-Weg 9
80339 München
+49 (0)89 210932-74
florian.hohenauer@hotwirepr.com
http://www.hotwirepr.com