Tag Archives: semiconductor

Automotive Traffic

Autonomous Driving: Optical Data Network Enhances Safety

KDPOF Demos Seamless and EMC-compliant Network Integration at AESIN Conference and at IEEE SA Ethernet & IP @ Auto Tech Day

Autonomous Driving: Optical Data Network Enhances Safety

KDPOF’s optical data network enhances safety for autonomous driving

KDPOF – leading supplier for gigabit transceivers over POF (Plastic Optical Fiber) – provides their optical network technology in order to enhance safety for autonomous driving. „For safety-related functions such as the data network backbone, autonomous driving requires redundant systems in order to increase safety and avoid the autonomous car locking up if one of the systems is disabled in some way,“ explained Ruben Perez de Aranda, CTO and Co-founder of KDPOF. Reliability analysis shows that a technology redundancy like optical and copper cabling provides the highest reliability. Consequently, more and more OEMs are now considering Plastic Optical Fiber. KDPOF will demonstrate the seamless and EMC-compliant network integration with POF at the AESIN (Automotive Electronics Innovation) Conference on October 2, 2018 in Solihull, UK, and at the IEEE-SA Ethernet & IP @ Automotive Technology Day on October 9-10, 2018 in London, UK.

EMC Lessons Learned on Gigabit Ethernet Implementation for ADAS & AV

In his presentation „EMC Lessons Learned on Gigabit Ethernet Implementation for ADAS & AV“ at the AESIN Conference on October 2, 2018 at 16:30, Ruben Perez de Aranda will describe the lessons learned in the iterative design process with the final goal of bringing into the market a mass-produced automotive Gigabit Ethernet PHY integrated in an ECU and meeting the most stringent EMC specifications. „This grows more important as in-car network speeds increase to accommodate the demands of driverless systems,“ he added. „Higher speeds are achieved by wider use of the electromagnetic spectrum.“ This situation makes the underlying communication system implementation less immune to radiated and conducted noise. It also forces OEMs to impose more and more stringent emissions limits on the electronic components, limits that are often already tighter than the demands imposed by international standards. POF is ideal for the new architectures since it provides natural galvanic isolation between communicating modules and a radiation-free harness.

With the first automotive Gigabit Ethernet POF (GEPOF) transceiver KD1053, KDPOF provides high connectivity with a flexible digital host interface, low latency, low jitter, and low linking time. The transceiver complies with the standard amendment IEEE Std 802.3bv™ and thus fully meets the requirements of carmakers.

About KDPOF

Fabless semiconductor supplier KDPOF provides innovative gigabit and long-reach communications over Plastic Optical Fiber (POF). Making gigabit communication over POF a reality, KDPOF technology supplies 1 Gbps POF links for automotive, industrial, and home networks. Founded in 2010 in Madrid, Spain, KDPOF offer their technology as either ASSP or IP (Intellectual Property) to be integrated in SoCs (System-on-Chips). The adaptive and efficient system works with a wide range of optoelectronics and low-cost large core optical fibers, thus delivering carmakers low risks, costs and short time-to-market.

Company-Contact
KDPOF
Óscar Ciordia
Ronda de Poniente 14 2ºA
28760 Tres Cantos
Phone: +34 91 8043387
E-Mail: ma@ahlendorf-communication.com
Url: http://www.kdpof.com

Press
ahlendorf communication
Mandy Ahlendorf
Schiffbauerweg 5F
82319 Starnberg
Phone: +4981519739098
E-Mail: ma@ahlendorf-communication.com
Url: http://www.ahlendorf-communication.com

Auto Verkehr Logistik

Autonomes Fahren: Optisches Datennetzwerk erhöht Sicherheit

KDPOF zeigt mühelose und EMV-gerechte Netzwerk-Integration auf AESIN-Konferenz und IEEE SA Ethernet & IP @ Auto Tech Day

Autonomes Fahren: Optisches Datennetzwerk erhöht Sicherheit

Das optische Datennetzwerk von KDPOF erhöht die Sicherheit für das autonome Fahren

KDPOF – führender Anbieter für die Gigabit-Vernetzung über POF (Polymere optische Faser) in Fahrzeugen – erhöht mit seiner optischen Netzwerktechnologie die Sicherheit beim autonomen Fahren. „Für sicherheitsrelevante Funktionen wie das Datennetzwerk-Backbone benötigt das autonome Fahren redundante Systeme, um die Verfügbarkeit zu erhöhen“, erläutert Ruben Perez de Aranda, CTO und Mitgründer von KDPOF. „So lässt sich vermeiden, dass das autonome Fahrzeug blockiert, wenn eines der Systeme in irgendeiner Form gestört ist.“ Zuverlässigkeitsanalysen zeigen, dass eine Technologie-Redundanz wie etwa Optik und Kupfer am verlässlichsten ist. Folglich ziehen immer mehr OEMs die optische Polymerfaser in Betracht. KDPOF präsentiert die mühelose und EMV-gerechte Netzwerk-Integration mit POF auf der AESIN (Automotive Electronics Innovation)-Konferenz am 2. Oktober 2018 in Solihull, UK, und auf dem IEEE-SA Ethernet & IP @ Automotive Technology Day vom 9. bis 10. Oktober 2018 in London, UK.

EMV-Erkenntnisse der Gigabit-Ethernet-Implementierung für ADAS und Audio/Video

In seiner Präsentation „Gewonnene EMV-Erkenntnisse der Gigabit-Ethernet-Implementierung für ADAS und Audio/Video“ wird Ruben Perez de Aranda auf der AESIN-Konferenz am 2. Oktober 2018 um 16:30 Uhr Erfahrungen und Erkenntnisse aus dem iterativen Design-Prozess erläutern. Das Ziel ist, einen serienproduzierten automotive Gigabit-Ethernet-Physical-Layer auf den Markt zu bringen, der in ein Steuergerät integriert ist und die strengsten EMV-Spezifikationen erfüllt. „Das wird immer wichtiger, da die Geschwindigkeiten von Fahrzeugnetzwerken ständig steigen, um die Anforderungen von fahrerlosen Systemen zu erfüllen“, ergänzt er. „Höhere Geschwindigkeiten erreichen wir durch eine breitere Nutzung des elektromagnetischen Spektrums.“ Diese Situation verringert die Immunität des zugrundeliegenden Kommunikationssystems gegenüber eingestrahlten und leitungsgebundenen Störungen. Zudem zwingt sie die OEMs, immer strengere Emissionsgrenzwerte für die elektronischen Komponenten zu verhängen: Grenzwerte, die meist bereits strenger sind als die von internationalen Standards erlassenen Forderungen. POF eignet sich daher ideal für die neuen Architekturen, da es eine natürliche galvanische Trennung zwischen den kommunizierenden Modulen und ein strahlungsfreies Kabel bietet.

Mit dem ersten automotive Gigabit-Ethernet-POF (GEPOF)-Transceiver KD1053 bietet KDPOF eine hohe Konnektivität mit einer flexiblen, digitalen Host-Schnittstelle, niedrige Latenz, geringen Jitter sowie eine kurze Aufbauzeit der Verbindung. Der Transceiver entspricht dem Standard-Zusatz IEEE Std 802.3bv™ und erfüllt damit die Anforderungen der Automobilhersteller vollständig.

Über KDPOF

Das Fabless-Halbleiterunternehmen KDPOF bietet innovative Gigabit- und Langstrecken-Kommunikation über POF (Plastic Optical Fiber). KDPOF lässt die Gigabit-Vernetzung über POF Wirklichkeit werden, indem die KDPOF-Technologie POF-Links mit 1 GBit/s für Automobil, Industrie- und Heimnetzwerke bereitstellt. Das 2010 in Madrid, Spanien, gegründete Unternehmen bietet seine Technologie entweder als ASSP (Application Specific Standard Product) oder als IP (Intellectual Property) für die Integration in System-on-Chips (SoCs) an. Das adaptive und effiziente System funktioniert mit einer großen Bandbreite an optoelektronischen Bauelementen und kostengünstigen optischen Fasern mit großem Kerndurchmesser. Damit gewährleistet KDPOF den Automobilherstellern niedrige Risiken, geringe Kosten und kurze Markteinführungszeiten.

Firmenkontakt
KDPOF
Óscar Ciordia
Ronda de Poniente 14 2ºA
28760 Tres Cantos
+34 91 8043387
ma@ahlendorf-communication.com
http://www.kdpof.com

Pressekontakt
ahlendorf communication
Mandy Ahlendorf
Schiffbauerweg 5F
82319 Starnberg
+4981519739098
ma@ahlendorf-communication.com
http://www.ahlendorf-communication.com

Computer Information Telecommunications

Boosting Customer Quality of Experience through Optical Connectivity

KDPOF Delivers Plastic Optical Fibers to Home Networks – Cost-efficient, Easy to Install, Robust

Boosting Customer Quality of Experience through Optical Connectivity

KDPOF speeds up home networking with POF backbone for higher Quality of Experience

KDPOF – leading supplier for gigabit transceivers over POF (Plastic Optical Fiber) – introduces a Plastic Optical Fiber backbone inside the home: in combination with Wi-Fi access points, POF provides end users with maximum performance for both wireless and wired connectivity throughout the house. POF reuses any existing conduits in the home, making these cables invisible. „ISPs and Telecom operators are offering higher and higher access speeds while users at home are locally connecting more and more devices to the internet,“ explained Carlos Pardo, CEO and Co-Founder of KDPOF. „The paradox is that while access speeds have increased, customer satisfaction rates drop if home networks cannot keep up.“

POF Enhances Quality of Experience

This is particularly worrisome because Quality of Experience has become a very important differentiator for broadband service providers. Customers expect to experience the speeds they are paying for. If these speeds are lower than expected, they will be disappointed and the Quality of Experience will be affected. KDPOF has been working closely with Telefonica in a trial to test the benefits of POF. KDPOF“s technology helps to provide subscribers with very high connectivity speeds all around the home, allowing users to enjoy high-quality video streaming such as 4K IPTV, and supporting services such as online gaming with the lowest latency. According to the results of the trial, Quality of Experience can increase dramatically, leading to a surge in customer loyalty. Sara Martin-Sanz Albendea, Project Manager with Telefonica and responsible for the project known within Telefonica as ‚Plastic Optical Fiber in the House‘: „KDPOF offers a great solution for improving customer satisfaction. Quality of Experience is a key success factor for Telefonica.“

Reliable High-speed Connectivity for Homes

ISPs and Telecom Operators have been investigating various potential solutions. No-New-Wires technologies such as Wireless Mesh or Powerline do not offer a clear alternative. These solutions have performance problems in houses with brick and mortar walls, or they are degraded since they depend too much on the existing and often old, low-quality cabling. New-cable solutions such as Ethernet Cabling require new ducts to be created, which is difficult for customers to accept. Plastic Optical Fiber, on the other hand, is cost-efficient, easy to install, and robust. By working with KDPOF, operators can offer their clients low latency, fast download speeds, and reliable connectivity for video.

About KDPOF

Fabless semiconductor supplier KDPOF provides innovative gigabit and long-reach communications over Plastic Optical Fiber (POF). Making gigabit communication over POF a reality, KDPOF technology supplies 1 Gbps POF links for automotive, industrial, and home networks. Founded in 2010 in Madrid, Spain, KDPOF offer their technology as either ASSP or IP (Intellectual Property) to be integrated in SoCs (System-on-Chips). The adaptive and efficient system works with a wide range of optoelectronics and low-cost large core optical fibers, thus delivering carmakers low risks, costs and short time-to-market.

Company-Contact
KDPOF
Óscar Ciordia
Ronda de Poniente 14 2ºA
28760 Tres Cantos
Phone: +34 91 8043387
E-Mail: ma@ahlendorf-communication.com
Url: http://www.kdpof.com

Press
ahlendorf communication
Mandy Ahlendorf
Schiffbauerweg 5F
82319 Starnberg
Phone: +4981519739098
E-Mail: ma@ahlendorf-communication.com
Url: http://www.ahlendorf-communication.com

Auto Verkehr Logistik

KDPOF ermöglicht mühelose Integration in optische Netzwerke

Polymere optische Faser gewinnt an Boden bei Gigabit-Ethernet-Vernetzung in Fahrzeugen

KDPOF ermöglicht mühelose Integration in optische Netzwerke

KDPOF bietet eine vollständige POF-Lösung zur nahtlosen Integration in das Bordnetz im Fahrzeug.

KDPOF – führender Anbieter für die Gigabit-Vernetzung über POF (Polymere optische Faser) in Fahrzeugen – präsentiert eine vollständige POF-Lösung zur mühelosen Integration in das Bordnetz im Fahrzeug. Auf dem internationalen Kongress ‚Bordnetze im Automobil‘ am 13. Und 14. März 2018 in Ludwigsburg zeigt KDPOF in Partnerschaft mit führenden Kabelsatzlieferanten wie TE und anderen innovative Gigabit-POF-Lösungen. „POF-Kabel sind ausgesprochen zuverlässig: Sie widerstehen rauen Umgebungen und vertragen Bedingungen wie beispielsweise das Verlegen durch den Motorraum bei hohen Temperaturen bis 105°C oder hinunter bis -40°C“, erläutert Carlos Pardo, CEO und Mitgründer von KDPOF. „Als optische Faser mit großem Kern toleriert es Vibrationen und Achsverschiebungen viel besser als andere optische oder Kupfer-Alternativen wie Glasfaser (Glass Optical Fiber, GOF), Koaxialkabel und STP.“

Bewährte Entwicklungsbeziehungen zwischen den weltweit führenden Optoelektronik-, Steckverbinder- und Kabelbaumanbietern gewährleisten einen gut liefer- und wettbewerbsfähigen Markt für alle im System notwendigen Komponenten: Physical Layer (PHY), faseroptische Transceiver (FOT), Faserkabel und Steckverbinder. Alle involvierten Hersteller wie Broadcom (ehemals Avago), Hamamatsu, KDPOF, TE und weitere sind gemeinsam mit den Organisationen IEEE und ISO bereit für die Marktchancen, die die neue Gigabit-POF-Technologie eröffnet.

Einfaches Handling und große Robustheit

Als Kunststofffaser mit großem Durchmesser lässt sich POF kostengünstig fertigen und installieren. POF benötigt keine ausgefeilte Ausrüstung oder Spezialqualifikation, und auch die Prozesse der Kabelbaumfertigung müssen nicht geändert werden. Die Installation ist einfaches Plug-and-Play. Wickeln und Befestigen entspricht etwa dem von Kupferkabeln. Das gute Biegeverhalten von POF beginnt bei einem Radius von zehn Millimetern. Die Entfernungen für die Gigabit-Übertragung reichen bis 40 Meter ohne Inline-Steckverbinder oder 15 Meter mit bis zu 4 Inline-Steckverbindern. Zudem erlaubt POF schnelles, dynamisches und enges Biegen sowie das Eintauchen in dunkle Flüssigkeiten, neben den Vorteilen des geringen Rauschens und der Robustheit bezüglich des Einkoppelns elektromagnetischer Felder.

Über KDPOF

Das Fabless-Halbleiterunternehmen KDPOF bietet innovative Gigabit- und Langstrecken-Kommunikation über POF (Plastic Optical Fiber). KDPOF lässt die Gigabit-Vernetzung über POF Wirklichkeit werden, indem die KDPOF-Technologie POF-Links mit 1 GBit/s für Automobil, Industrie- und Heimnetzwerke bereitstellt. Das 2010 in Madrid, Spanien, gegründete Unternehmen bietet seine Technologie entweder als ASSP (Application Specific Standard Product) oder als IP (Intellectual Property) für die Integration in System-on-Chips (SoCs) an. Das adaptive und effiziente System funktioniert mit einer großen Bandbreite an optoelektronischen Bauelementen und kostengünstigen optischen Fasern mit großem Kerndurchmesser. Damit gewährleistet KDPOF den Automobilherstellern niedrige Risiken, geringe Kosten und kurze Markteinführungszeiten.

Firmenkontakt
KDPOF
Óscar Ciordia
Ronda de Poniente 14 2ºA
28760 Tres Cantos
+34 91 8043387
ma@ahlendorf-communication.com
http://www.kdpof.com

Pressekontakt
ahlendorf communication
Mandy Ahlendorf
Schiffbauerweg 5F
82319 Starnberg
+4981519739098
ma@ahlendorf-communication.com
http://www.ahlendorf-communication.com

Automotive Traffic

KDPOF Enables Seamless Optical Networks Integration

Plastic Optical Fiber Gains Ground for Gigabit Ethernet Connectivity in Vehicles

KDPOF Enables Seamless Optical Networks Integration

KDPOF provides a complete POF solution to be seamlessly integrated into the harness of the vehicle.

KDPOF – leading supplier for automotive gigabit transceivers over POF (Plastic Optical Fiber) – is delighted to present a complete POF solution to be seamlessly integrated into the wire harness of the vehicle. At the International Congress Automotive Wire Harness on March 13 and 14, 2018 in Ludwigsburg, Germany, KDPOF will display innovative gigabit POF solutions in partnership with leading wire harness suppliers such as TE and others. „POF cables are very reliable: they can withstand harsh environments and tolerate conditions such as routing across the engine compartment with temperatures as high as 105°C and down to -40°C,“ stated Carlos Pardo, CEO and Co-founder of KDPOF. „As an optical fiber with a large core, POF is able to withstand vibrations and misalignments much better than other optical or copper alternatives such as glass optical fiber (GOF), coax, and STP.“

Well-established engineering collaboration between key leading optoelectronic, connector, and wire harness vendors worldwide ensures a well-supplied and competitive market for all the components needed in the system: Physical Layer (PHY), Fiber Optic Transceiver (FOT), fiber cable, and connectors. All these companies, such as Broadcom (formerly Avago), Hamamatsu, KDPOF, TE, and others, as well as the IEEE and ISO, are ready for the market opportunities that the new gigabit POF technology has opened.

Easy Handling and High Robustness

As a plastic, wide diameter fiber, POF is cheap to manufacture and install. It does not require any sophisticated equipment or professional qualification, and harness manufacturing processes do not need to be changed. Installation is just easy plug and play. Winding and clamping is similar to copper cables. Their good bending performance starts at a radius of 10 mm. Gigabit transmission distances of up to 40 meters are possible without in-line connectors, or 15 meters with up to 4 in-liners. Further, POF allows fast dynamic bending, tight bending, and dark liquid immersion in addition to delivering low noise and robustness regarding incoupling of electromagnetic fields.

About KDPOF

Fabless semiconductor supplier KDPOF provides innovative gigabit and long-reach communications over Plastic Optical Fiber (POF). Making gigabit communication over POF a reality, KDPOF technology supplies 1 Gbps POF links for automotive, industrial, and home networks. Founded in 2010 in Madrid, Spain, KDPOF offer their technology as either ASSP or IP (Intellectual Property) to be integrated in SoCs (System-on-Chips). The adaptive and efficient system works with a wide range of optoelectronics and low-cost large core optical fibers, thus delivering carmakers low risks, costs and short time-to-market.

Company-Contact
KDPOF
Óscar Ciordia
Ronda de Poniente 14 2ºA
28760 Tres Cantos
Phone: +34 91 8043387
E-Mail: ma@ahlendorf-communication.com
Url: http://www.kdpof.com

Press
ahlendorf communication
Mandy Ahlendorf
Schiffbauerweg 5F
82319 Starnberg
Phone: +4981519739098
E-Mail: ma@ahlendorf-communication.com
Url: http://www.ahlendorf-communication.com

Electric Electronics

ERS appoints seasoned expert to fill new CSMO position

ERS appoints seasoned expert to fill new CSMO position

New Chief Sales and Marketing Officer at ERS electronic GmbH: Laurent Giai-Miniet (Source: Laurent Giai-Miniet)

MUNICH, 18 July, 2017 – Effective immediately, Laurent Giai-Miniet is the new Chief Sales and Marketing Officer (CSMO) at ERS electronic GmbH, the world leading provider of thermal test solutions for semiconductor manufacturing.

Laurent Giai-Miniet brings more than 25 years of experience in the semiconductor, global electronics and Internet of Things spaces. Laurent has held leadership positions at companies such as Texas Instruments and Infineon. In one of his most recent roles as CEO, Laurent Giai-Miniet successfully completed the turnaround of the energy harvesting technology leader EnOcean from a German-centric startup to a leading global provider of self-powered IoT solutions.

Laurent“s primary task will be to accelerate the company growth and increase its visibility in the global semiconductor equipment market. „I am excited to join the ERS team and I look forward to building on the foundations of a strong customer base, a talented team and a world-class product to take ERS“s business to the next level“, said Laurent Giai-Miniet.

„Laurent has an impressive track record of growing and scaling businesses“, said Klemens Reitinger, CEO of ERS electronic GmbH. „He brings with him excellent connections from across the worldwide semiconductor industry and a very good understanding of the specific needs and challenges of a growing company like ERS. I am very pleased to be working with him and to further build ERS“s business.“

Laurent holds an MBA (DESS) from the Institut d’Administration des Entreprises (IAE) of Aix-en-Provence (France) as well as an MSc in Technical Marketing of Measurement Instrumentation.

ERS electronic GmbH, based in Germering near Munich, has been producing innovative thermal test solutions for the semiconductor industry for more than 45 years. The company has gained an outstanding reputation in this sector, notably with its fast and accurate thermal chuck systems for test temperatures ranging from -65°C to +500°C for analytical, parameter-related and manufacturing tests. Today, thermal chuck systems developed by ERS with its product families AC3, AirCool©, AirCool© plus and PowerSense© are an integral component in all large-size wafer probers right across the chip industry.

Company-Contact
ERS electronic GmbH
Klemens Reitinger
Stettinerstraße 3+5
82110 Germering
Phone: +49-89-8941320
E-Mail: kreitinger@ers-gmbh.de
Url: http://www.ers-gmbh.com

Press
Brand+Image
Timothy Göbel
Von-Eichendorff-Str. 41
86911 Dießen a.A.
Phone: 08807 9475642
E-Mail: ERS@brandandimage.de
Url: http://www.brandandimage.de

English Press Releases

Rehm opens new branch in Taiwan

Expansion of the Sales and Service department in Asia

Rehm opens new branch in Taiwan

(from left) Andy Wang, Ralf Wagenfuehr, Ricky Lam, Titan Huang, Johnson Ma, Jack Deng und Arie Chen

With around 23 million inhabitants spread across an area roughly the size of the German state of Baden-Württemberg, Taiwan is one of the smaller countries in Asia. In the electronics industry, however, the island is a major global player, with leading manufacturers such as Asus, Acer and HTC becoming global brands in recent years. In order to meet the needs of Asian electronics manufacturers and strengthen partnerships with them, Rehm Thermal Systems has recently set up a new branch in Taiwan.
Together with long-term clients and business partners, the Rehm team celebrated the opening of the branch and the inauguration of the new premises, led by Regional Sales Director Titan Huang.

„A clear trend in the Asian electronics market is, in particular, massive growth in the semiconductor industry. With the new branch, we are offering customers in Taiwan and the region even more reliable sales services and faster support, with particular focus on semiconductors. But the team is also on hand to offer help and advice on any other queries regarding Rehm“s product range“, says Michael Hanke, Rehm’s Chief Customer Officer.

In the Technology Center on site, thermal processes can be optimized together with customers and partners and numerous applications can be tested and compared.

Contact:
Rehm Thermal Systems Limited Taiwan Office
1F, 75#, Qingpu 4th Street, Zhongli Dist., Taoyuan City, Taiwan
Regional Sales Director: Titan Huang
titan.huang@cn.rehm-group.com
T: +886 919358442
F: +886 (03) 287 2298

As a specialist in the field of thermal system solutions for the electronics and photovoltaics industries, Rehm is a technology and innovation leader in the modern and economical production of electronic modules. As a globally operating manufacturer of reflow soldering systems with convection, condensation or vacuum, drying and coating systems, functional test systems, equipment for the metallisation of solar cells as well as numerous customer-specific special systems, we are represented in all relevant growth markets and, as a partner with more than 25 years of industry experience, we implement innovative manufacturing solutions that set standards.

Contact
Rehm Thermal Systems
Anna-Katharina Peuker
Leinenstraße 7
89143 Blaubeuren
Phone: 07344 9606 746
Fax: 07344 9606 525
E-Mail: ak.peuker@rehm-group.com
Url: http://www.rehm-group.com

Wirtschaft Handel Maschinenbau

Rehm eröffnet neue Niederlassung in Taiwan

Ausbau des Bereichs Sales und Service in Asien

Rehm eröffnet neue Niederlassung in Taiwan

(v.l.) Andy Wang, Ralf Wagenfuehr, Ricky Lam, Titan Huang, Johnson Ma, Jack Deng und Arie Chen

Mit etwa 23 Millionen Einwohnern, die sich ungefähr die Fläche Baden-Württembergs teilen, gehört Taiwan zu den kleineren Ländern Asiens. In der Elektronikindustrie zählt die Insel jedoch zu den bedeutenden Global Playern: Namhafte Hersteller wie Asus, Acer und HTC entwickelten sich in den vergangenen Jahren zu Weltmarken. Um den Bedürfnissen asiatischer Elektronikproduzenten besser gerecht zu werden und die Kooperation mit ihnen zu verstärken, hat Rehm Thermal Systems kürzlich eine neue Niederlassung in Taiwan gegründet.

Die Eröffnung der Niederlassung mit Einweihung der neuen Räumlichkeiten feierte das Team von Rehm, unter Leitung von Regional Sales Director Titan Huang, gemeinsam mit langjährigen Kunden und Geschäftspartnern.

„Ein deutlicher Trend im asiatischen Elektronikmarkt ist vor allem der große Zuwachs in der Halbleiterindustrie. Mit der neuen Niederlassung bieten wir Kunden in Taiwan und Umgebung noch zuverlässigere Vertriebsleistungen und schnelleren Support, mit besonderem Fokus auf dem Bereich Semiconductor. Aber auch zu allen anderen Fragen rund um das Rehm Produktportfolio steht das Sales und Service Team mit Rat und Tat zur Seite“, sagt Michael Hanke, Vertriebsleiter weltweit bei Rehm.

Im Technology Center vor Ort können thermische Prozesse gemeinsam mit Kunden und Partnern optimiert sowie zahlreiche Applikationen getestet und verglichen werden.

Kontakt:
Rehm Thermal Systems Limited Taiwan Office
1F, 75#, Qingpu 4th Street, Zhongli Dist., Taoyuan City, Taiwan
Regional Sales Director: Titan Huang
titan.huang@cn.rehm-group.com
T: +886 919358442
F: +886 (03) 287 2298

Die Firma Rehm zählt als Spezialist im Bereich thermische Systemlösungen für die Elektronik- und Photovoltaikindustrie zu den Technologie- und Innovationsführern in der modernen und wirtschaftlichen Fertigung elektronischer Baugruppen. Als global agierender Hersteller von Reflow-Lötsystemen mit Konvektion, Kondensation oder Vakuum, Trocknungs- und Beschichtungsanlagen, Funktionstestsystemen, Equipment für die Metallisierung von Solarzellen sowie zahlreichen kundenspezifischen Sonderanlagen sind wir in allen relevanten Wachstumsmärkten vertreten und realisieren als Partner mit mehr als 25 Jahren Branchenerfahrung innovative Fertigungslösungen, die Standards setzen.

Kontakt
Rehm Thermal Systems
Anna-Katharina Peuker
Leinenstraße 7
89143 Blaubeuren
07344 9606 746
07344 9606 525
ak.peuker@rehm-group.com
http://www.rehm-group.com

Electric Electronics

ERS Competence Center celebrates fifth anniversary

High customer acceptance, rising number of application areas

ERS Competence Center celebrates fifth anniversary

(Source: ERS electronic GmbH)

MUNICH, September 27, 2016 – ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor production, looks back to five extraordinary successful years of operating its Fan-out Wafer Level Packaging (FOWL) test competence center in Munich. The center enjoys rising popularity among customers, fuelled not least by the second wave of the Advanced Packaging technology expansion that currently can be observed across the semiconductor industry.

„In retrospect, the decision to launch this Competence Center five years ago has been very fruitful and future-oriented“, says ERS Managing Director Klemens Reitinger. Though the technology has made significant progress, some fundamental issues persist – in particular those related to the proper separation of the reconstituted wafer from its temporary carrier as well as to workpiece warpage. „To both problems, we are offering solutions that can be tested in our Competence Center. Most of these solutions are based on our protected intellectual property“, Reitinger explains.

ERS observed that since 2015 the second wave of the Advanced Packaging Technology Expansion started to gain traction, triggering a significant increase in the number of market participants. OSATs (Outsourced Semiconductor Assembly and Test), material manufacturers, equipment vendors and research institutes alike are intensifying their activities in the area of embedded Wafer Level BGA (eWLB). Also, eWLB package manufacturing processes have evolved since the time the Competence Center has opened its doors. A diversity of materials and processes has unfolded. Metal, glass, silicon, diverse new potting compounds have entered the scene along with new process concepts like Chip First or RDL First. At the same time, the variety of end products and applications leveraging Advanced Packaging has grown substantially: Extremely slim smartphones, smart watches, IoT devices and even automotive products such as radar sensors are manufactured using Advanced Packaging, to name just a few examples.

The Competence Center is a significant contribution to ERS“ appeal as a leading vendor of manufacturing and development equipment. Mr. Reitinger describes the formula for success: „Strict confidentiality, no fees. Thus, we can remain open for the technological progress and can deliver results quickly and unbureaucratically.“ ERS“ reward: „Since our customers know they can trust us, we are aware of new technology trends at a very early stage. This enables us to integrate our solutions into products and manufacturing equipment more quickly.“

ERS electronic GmbH, based in Germering near Munich, has been producing innovative thermal test solutions for the semiconductor industry for 45 years. The company has gained an outstanding reputation in the sector, notably with its fast and accurate thermal chuck systems for test temperatures ranging from -65°C to +500°C for analytical, parameter-related and manufacturing tests. Today, thermal chuck systems developed by ERS in its product families AC3, AirCool©, AirCool© plus and PowerSense© are an integral component in all larger-sized wafer probers right across the chip industry.

Firmenkontakt
ERS electronic GmbH
Klemens Reitinger
Stettinerstraße 3+5
82110 Germering
+49-89-8941320
kreitinger@ers-gmbh.de
http://www.ers-gmbh.com

Pressekontakt
Brand+Image
Timothy Göbel
Von-Eichendorff-Str. 41
86911 Dießen a.A.
08807 9475642
ERS@brandandimage.de

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ERS showcases Thermal Chuck and eWLB Test Product Line-up at Semicon Taiwan

Semicon Taiwan: Booth 2522, 1st floor

ERS showcases Thermal Chuck and eWLB Test Product Line-up at Semicon Taiwan

(Source: ERS electronic GmbH)

MUNICH, September 1, 2016 – ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor production, will showcase its product line at the Semicon Taiwan trade fair (September 7 – 9). At the exhibition, ERS shares its stand with its sales partner Chain Logic International Corp. (CLIC), highlighting the trusting and fruitful cooperation between ERS and CLIC.

ERS Asia General Manager Harald Ibele will be attending the event on behalf of ERS and is available to meet for any questions regarding wafer probe or eWLB style warpage adjust equipment and processes. „This joint exhibition presence highlights the trusting and fruitful cooperation between ERS and CLIC“, said Ibele. „With the proven quality of our products and services we will continue our successful relationship.“

ERS excels in high accuracy, low noise thermal chucks for high-end wafer test for technologically demanding segments of the semiconductor industry such as the automotive, medical and aerospace markets as well as R&D.

Semicon Taiwan is the premiere event for the semiconductor industry in Asia, bringing together manufacturers, suppliers and business customers from all over the world. Taiwan is known for having the largest concentration of foundries and test houses globally. With its current line-up of technologically advanced test solutions, ERS, together with its distribution partner Chain Logic, is extremely well positioned to break into this demanding market. ERS“ latest developments in the field of Thermal Wafer Chucks will take center stage at the company“s exhibits in booth 2522, 1st floor.

Semicon Taiwan, one of the largest events of its kind around the globe, is expected to attract 43.000 visitors and 3.300 program participants; more than 700 exhibitors from all over the world will showcase their products in 1600+ booths.

ERS electronic GmbH, based in Germering near Munich, has been producing innovative thermal test solutions for the semiconductor industry for 45 years. The company has gained an outstanding reputation in the sector, notably with its fast and accurate thermal chuck systems for test temperatures ranging from -65°C to +500°C for analytical, parameter-related and manufacturing tests. Today, thermal chuck systems developed by ERS in its product families AC3, AirCool©, AirCool© plus and PowerSense© are an integral component in all larger-sized wafer probers right across the chip industry.

Firmenkontakt
ERS electronic GmbH
Klemens Reitinger
Stettinerstraße 3+5
82110 Germering
+49-89-8941320
kreitinger@ers-gmbh.de
http://www.ers-gmbh.com

Pressekontakt
Brand+Image
Timothy Göbel
Von-Eichendorff-Str. 41
86911 Dießen a.A.
08807 9475642
ERS@brandandimage.de

Home