Tag Archives: FOWLP

Electric Electronics

ERS boosts productivity in FOWLP debonding and wafer testing

Semicon China: Hall W4, Booth 4143-1

ERS boosts productivity in FOWLP debonding and wafer testing

ERS‘ debonding machines for FOWLP (Fan-out Wafer-Level Packaging) (Source: ERS electronic GmbH)

MUNICH, 22 February 2017 – ERS electronic GmbH, the innovation leader in the market of Fan-out Wafer-Level Packaging (FOWLP) debonding and thermal test solutions for semiconductor production, will showcase its latest technology developments at Semicon China in Shanghai (March 14 – 16).

ERS is resuming its presence at Semicon China after 12 years with the introduction of several new products that significantly increase FOWLP debonding and wafer test throughput. „With many independent technology developments, the semiconductor equipment market of mainland China has reached a high degree of maturity and is developing impressive dynamics,“ explained Klemens Reitinger, Managing Director of ERS electronic GmbH. „At the present level of technological differentiation, highly sophisticated products and specialized expertise are in high demand. This translates into excellent prospects for our business.“

Video presentations of four new debonding machines for FOWLP (Fan-out Wafer-Level Packaging) manufacturing processes will take center stage of ERS“ Semicon China“s presence. These machines – type designations ADM330, WAT330, MDM330, MWAT330 – are covering the entire range of debonding and warpage adjust application environments from prototype lab to fully-automated high-volume production, offering carefully graduated combinations of high throughput and flexibility for the respective environments. Based on ERS“ long-standing experience with design and applications of such products, the four new machines have already been put through their paces at ERS“ development facilities and are now ready for market launch with immediate start of series production. „Fully automatic machines that ensure higher productivity and flexibility for the user – this is what currently is the focus of our customers“ demand,“ commented Reitinger.

ERS will share its booth at Semicon China with its distribution partners Chain Logic International Corp. (CLIC) and MPI Corp.

ERS electronic GmbH, based in Germering near Munich (Germany), has been producing innovative thermal test solutions for the semiconductor industry for 45 years. The company has gained an outstanding reputation in the sector, notably with its fast and accurate thermal chuck systems for test temperatures ranging from -65°C to +500°C for analytical, parameter-related and manufacturing tests. Today, thermal chuck systems developed by ERS in its product families AC3, AirCool©, AirCool© plus and PowerSense© are an integral component in all larger-sized wafer probers right across the chip industry.

Firmenkontakt
ERS electronic GmbH
Klemens Reitinger
Stettinerstraße 3+5
82110 Germering
+49-89-8941320
kreitinger@ers-gmbh.de
http://www.ers-gmbh.com

Pressekontakt
Brand+Image
Timothy Göbel
Von-Eichendorff-Str. 41
86911 Dießen a.A.
08807 9475642
ERS@brandandimage.de
http://www.brandandimage.de

Electric Electronics

ERS ready for imminent eWLB upswing

Emerging semiconductor manufacturing technology

ERS ready for imminent eWLB upswing

(Source: ERS electronic GmbH)

MUNICH, August 2, 2016 – ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor production, sees excellent growth opportunities in the emerging eWLB / FOWLP (Fan Out Wafer Level Packaging) advanced packaging technology. ERS expects this market to grow at a pace of more than 30 per cent annually – and ERS is extremely well positioned to benefit from this situation.

eWLB (Embedded Wafer-Level Ball Grid Array) is a very economical packaging technology for the advanced semiconductor solutions required for innovative application areas such as Internet of Things, sensors, automation and mobility. It enables semiconductor manufacturers to create chips with smaller footprint, thinner package and better electrical properties than possible with conventional flip-chip BGA packaging. Therefore it is a crucial technology to create space-saving yet powerful solutions. Since this technology is already proven in mass production at renowned semiconductor manufacturers and offers substantial technological and cost benefits, it can be expected that it will reach a very high popularity throughout the entire semiconductor industry.

Due to its world-leading thermal expertise, ERS has been involved in the development of this technology from its inception. For more than six years, ERS“ equipment is deployed in the most demanding mass-production environments at leading semiconductor manufacturers and OSATS worldwide. For this reason, ERS has a unique position in the emergent dynamic market for eWLB manufacturing equipment and will fully benefit from the rising demand for such equipment. With its sound experience in thermal treatment as well as in eWLB manufacturing processes, ERS can support manufacturers to get their processes stable and economic and can adapt its equipment quickly to new requirements.

On the basis of this unique set of capabilities and expertise, ERS has won two major customers in this global market within only six months. Through its eWLB Competence Center, located at the ERS headquarters near Munich, ERS is actively involved into further developing the technology. This enables the company to quickly react on changing market and technology conditions. Even more important, through this Competence Center ERS is an active eWLB technology player and has immediate access to all new developments from their beginning.

ERS electronic GmbH, based in Germering near Munich, has been producing innovative thermal test solutions for the semiconductor industry for 45 years. The company has gained an outstanding reputation in the sector, notably with its fast and accurate thermal chuck systems for test temperatures ranging from -65°C to +500°C for analytical, parameter-related and manufacturing tests. Today, thermal chuck systems developed by ERS in its product families AC3, AirCool©, AirCool© plus and PowerSense© are an integral component in all larger-sized wafer probers right across the chip industry.

Firmenkontakt
ERS electronic GmbH
Klemens Reitinger
Stettinerstraße 3+5
82110 Germering
+49-89-8941320
kreitinger@ers-gmbh.de
http://www.ers-gmbh.com

Pressekontakt
Brand+Image
Timothy Göbel
Von-Eichendorff-Str. 41
86911 Dießen a.A.
08807 9475642
ERS@brandandimage.de

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