Tag Archives: eWLB

Electric Electronics

ERS Competence Center celebrates fifth anniversary

High customer acceptance, rising number of application areas

ERS Competence Center celebrates fifth anniversary

(Source: ERS electronic GmbH)

MUNICH, September 27, 2016 – ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor production, looks back to five extraordinary successful years of operating its Fan-out Wafer Level Packaging (FOWL) test competence center in Munich. The center enjoys rising popularity among customers, fuelled not least by the second wave of the Advanced Packaging technology expansion that currently can be observed across the semiconductor industry.

„In retrospect, the decision to launch this Competence Center five years ago has been very fruitful and future-oriented“, says ERS Managing Director Klemens Reitinger. Though the technology has made significant progress, some fundamental issues persist – in particular those related to the proper separation of the reconstituted wafer from its temporary carrier as well as to workpiece warpage. „To both problems, we are offering solutions that can be tested in our Competence Center. Most of these solutions are based on our protected intellectual property“, Reitinger explains.

ERS observed that since 2015 the second wave of the Advanced Packaging Technology Expansion started to gain traction, triggering a significant increase in the number of market participants. OSATs (Outsourced Semiconductor Assembly and Test), material manufacturers, equipment vendors and research institutes alike are intensifying their activities in the area of embedded Wafer Level BGA (eWLB). Also, eWLB package manufacturing processes have evolved since the time the Competence Center has opened its doors. A diversity of materials and processes has unfolded. Metal, glass, silicon, diverse new potting compounds have entered the scene along with new process concepts like Chip First or RDL First. At the same time, the variety of end products and applications leveraging Advanced Packaging has grown substantially: Extremely slim smartphones, smart watches, IoT devices and even automotive products such as radar sensors are manufactured using Advanced Packaging, to name just a few examples.

The Competence Center is a significant contribution to ERS“ appeal as a leading vendor of manufacturing and development equipment. Mr. Reitinger describes the formula for success: „Strict confidentiality, no fees. Thus, we can remain open for the technological progress and can deliver results quickly and unbureaucratically.“ ERS“ reward: „Since our customers know they can trust us, we are aware of new technology trends at a very early stage. This enables us to integrate our solutions into products and manufacturing equipment more quickly.“

ERS electronic GmbH, based in Germering near Munich, has been producing innovative thermal test solutions for the semiconductor industry for 45 years. The company has gained an outstanding reputation in the sector, notably with its fast and accurate thermal chuck systems for test temperatures ranging from -65°C to +500°C for analytical, parameter-related and manufacturing tests. Today, thermal chuck systems developed by ERS in its product families AC3, AirCool©, AirCool© plus and PowerSense© are an integral component in all larger-sized wafer probers right across the chip industry.

Firmenkontakt
ERS electronic GmbH
Klemens Reitinger
Stettinerstraße 3+5
82110 Germering
+49-89-8941320
kreitinger@ers-gmbh.de
http://www.ers-gmbh.com

Pressekontakt
Brand+Image
Timothy Göbel
Von-Eichendorff-Str. 41
86911 Dießen a.A.
08807 9475642
ERS@brandandimage.de

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Electric Electronics

ERS showcases Thermal Chuck and eWLB Test Product Line-up at Semicon Taiwan

Semicon Taiwan: Booth 2522, 1st floor

ERS showcases Thermal Chuck and eWLB Test Product Line-up at Semicon Taiwan

(Source: ERS electronic GmbH)

MUNICH, September 1, 2016 – ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor production, will showcase its product line at the Semicon Taiwan trade fair (September 7 – 9). At the exhibition, ERS shares its stand with its sales partner Chain Logic International Corp. (CLIC), highlighting the trusting and fruitful cooperation between ERS and CLIC.

ERS Asia General Manager Harald Ibele will be attending the event on behalf of ERS and is available to meet for any questions regarding wafer probe or eWLB style warpage adjust equipment and processes. „This joint exhibition presence highlights the trusting and fruitful cooperation between ERS and CLIC“, said Ibele. „With the proven quality of our products and services we will continue our successful relationship.“

ERS excels in high accuracy, low noise thermal chucks for high-end wafer test for technologically demanding segments of the semiconductor industry such as the automotive, medical and aerospace markets as well as R&D.

Semicon Taiwan is the premiere event for the semiconductor industry in Asia, bringing together manufacturers, suppliers and business customers from all over the world. Taiwan is known for having the largest concentration of foundries and test houses globally. With its current line-up of technologically advanced test solutions, ERS, together with its distribution partner Chain Logic, is extremely well positioned to break into this demanding market. ERS“ latest developments in the field of Thermal Wafer Chucks will take center stage at the company“s exhibits in booth 2522, 1st floor.

Semicon Taiwan, one of the largest events of its kind around the globe, is expected to attract 43.000 visitors and 3.300 program participants; more than 700 exhibitors from all over the world will showcase their products in 1600+ booths.

ERS electronic GmbH, based in Germering near Munich, has been producing innovative thermal test solutions for the semiconductor industry for 45 years. The company has gained an outstanding reputation in the sector, notably with its fast and accurate thermal chuck systems for test temperatures ranging from -65°C to +500°C for analytical, parameter-related and manufacturing tests. Today, thermal chuck systems developed by ERS in its product families AC3, AirCool©, AirCool© plus and PowerSense© are an integral component in all larger-sized wafer probers right across the chip industry.

Firmenkontakt
ERS electronic GmbH
Klemens Reitinger
Stettinerstraße 3+5
82110 Germering
+49-89-8941320
kreitinger@ers-gmbh.de
http://www.ers-gmbh.com

Pressekontakt
Brand+Image
Timothy Göbel
Von-Eichendorff-Str. 41
86911 Dießen a.A.
08807 9475642
ERS@brandandimage.de

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Electric Electronics

ERS ready for imminent eWLB upswing

Emerging semiconductor manufacturing technology

ERS ready for imminent eWLB upswing

(Source: ERS electronic GmbH)

MUNICH, August 2, 2016 – ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor production, sees excellent growth opportunities in the emerging eWLB / FOWLP (Fan Out Wafer Level Packaging) advanced packaging technology. ERS expects this market to grow at a pace of more than 30 per cent annually – and ERS is extremely well positioned to benefit from this situation.

eWLB (Embedded Wafer-Level Ball Grid Array) is a very economical packaging technology for the advanced semiconductor solutions required for innovative application areas such as Internet of Things, sensors, automation and mobility. It enables semiconductor manufacturers to create chips with smaller footprint, thinner package and better electrical properties than possible with conventional flip-chip BGA packaging. Therefore it is a crucial technology to create space-saving yet powerful solutions. Since this technology is already proven in mass production at renowned semiconductor manufacturers and offers substantial technological and cost benefits, it can be expected that it will reach a very high popularity throughout the entire semiconductor industry.

Due to its world-leading thermal expertise, ERS has been involved in the development of this technology from its inception. For more than six years, ERS“ equipment is deployed in the most demanding mass-production environments at leading semiconductor manufacturers and OSATS worldwide. For this reason, ERS has a unique position in the emergent dynamic market for eWLB manufacturing equipment and will fully benefit from the rising demand for such equipment. With its sound experience in thermal treatment as well as in eWLB manufacturing processes, ERS can support manufacturers to get their processes stable and economic and can adapt its equipment quickly to new requirements.

On the basis of this unique set of capabilities and expertise, ERS has won two major customers in this global market within only six months. Through its eWLB Competence Center, located at the ERS headquarters near Munich, ERS is actively involved into further developing the technology. This enables the company to quickly react on changing market and technology conditions. Even more important, through this Competence Center ERS is an active eWLB technology player and has immediate access to all new developments from their beginning.

ERS electronic GmbH, based in Germering near Munich, has been producing innovative thermal test solutions for the semiconductor industry for 45 years. The company has gained an outstanding reputation in the sector, notably with its fast and accurate thermal chuck systems for test temperatures ranging from -65°C to +500°C for analytical, parameter-related and manufacturing tests. Today, thermal chuck systems developed by ERS in its product families AC3, AirCool©, AirCool© plus and PowerSense© are an integral component in all larger-sized wafer probers right across the chip industry.

Firmenkontakt
ERS electronic GmbH
Klemens Reitinger
Stettinerstraße 3+5
82110 Germering
+49-89-8941320
kreitinger@ers-gmbh.de
http://www.ers-gmbh.com

Pressekontakt
Brand+Image
Timothy Göbel
Von-Eichendorff-Str. 41
86911 Dießen a.A.
08807 9475642
ERS@brandandimage.de

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