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ERS zeigt innovative Backend-Verfahren auf der Semicon Europa

ERS zeigt innovative Backend-Verfahren auf der Semicon Europa

München, 2. November 2017 – Die ERS electronic GmbH, Innovationsführer im Markt thermischer Testlösungen für die Halbleiterfertigung, präsentiert auf der Semicon Europa ihre innovative Technologie. Zusammen mit der parallel stattfindenden Weltleitmesse Productronica ist die Veranstaltung der größte Treffpunkt für Mikroelektronik in Europa. Für die zahlreichen europäischen Kunden von ERS ist dies eine hervorragende Gelegenheit, sich über die Produkt- und Technologieinnovationen des Unternehmens auf dem Laufenden zu halten.

ERS verfügt über eine solide und wachsende installierte Basis unter den hochmodernen Halbleiterherstellern und Forschungseinrichtungen Europas. Obwohl heute mehr als 50 Prozent der ERS-Lieferungen an Kunden in Asien erfolgen, sind Europa und seine Halbleiterindustrie nach wie vor für Innovation und Produktentwicklung unerlässlich. ERS betreibt in der europäischen Halbleiterhochburg Dresden ein Support-Zentrum. Darüber hinaus hat das Unternehmen in München ein eWLB (advanced Wafer Level Packaging) Kompetenzzentrum etabliert, um die schnell wachsenden FOWLP (Fan Out Wafer Level Packaging) Märkte im Halbleiter-Wertschöpfungs-Backend zu bedienen. Über diese Aktivitäten pflegt ERS eine enge Zusammenarbeit mit seinen Kunden, darunter mehrere erstrangige Unternehmen aus dem Bereich Halbleitertests. „Das Vertrauen, das uns unsere Kunden entgegenbringen, gibt uns große Impulse im Markt. Unsere Präsenz auf der Semicon Europa gibt uns die Möglichkeit, mit unseren Kunden in Kontakt zu treten, Informationen aus erster Hand über unsere neuen Produkte und Entwicklungen auszutauschen und ihre Bedürfnisse mit uns zu diskutieren“, so Laurent Giai-Miniet, CSMO der ERS electronic GmbH.

Yole Developpement (Yole) bestätigt den eindrucksvolle Siegeszug von FOWLP in der modernen Halbleiter-Packaging-Industrie: „Angetrieben durch zahlreiche Mehrwerte, darunter gute elektrische Leistung, hohe Integrationsfähigkeit und kleine Formfaktoren zu niedrigen Kosten verdoppelte sich der Markt zwischen 2015 und 2017. Zum Beispiel entschied sich auch Apple für TSMC’s FOWLP für ihren Applikationsprozessor“, erklärt Jerome Azemar, Activity Developer, Advanced Packaging & Semiconductor Manufacturing bei Yole. „Dieser Trend wird sich mit einer CAGR(1) von 2017 bis 2022 von 20 Prozent fortsetzen, dank der Übernahme von FOWLP durch weitere große Player“, erklärt das Strategieberatungs- und Marktforschungsunternehmen(2).

Auf der Semicon Europa stellt ERS erneut seine Innovationskraft unter Beweis. „Wir werden eine komplett neue Chuck-Familie auf den Markt bringen, die in Zusammenarbeit mit einem führenden Hersteller entwickelt wurde „, erklärt Laurent Giai-Miniet. „Dies ist die 4. Generation der Innovation in Thermischer Chucks. Langfristig erwarten wir, dass unsere FOWLP-Aktivitäten für uns ebenso bedeutend werden wie unser Geschäftsbereich Thermal Chucks.“

Kosteneffizienz und Testgenauigkeit

Sämtliche Teilmärkte und Anwendungen der Halbleitertechnologie sind durch raschen technologischen Fortschritt gekennzeichnet. Jede neue Chip-Generation zeichnet sich durch kleinere Geometrien, höhere Betriebsfrequenzen und einen geringeren Energieverbrauch aus. Dieser Fortschritt kann nur erreicht werden, wenn die Halbleiter im Laufe ihrer Produktion immer strengeren Tests unterzogen werden. Diese Tests ermöglichen eine erhöhte Genauigkeit,
Wiederholbarkeit, Flexibilität und Kosteneffizienz der Prüfverfahren. Das Test-Equipment von ERS electronic erfüllt diese Anforderungen durch das herausragende Know-how seiner Entwickler und ihr sprichwörtliches Qualitätsbewusstsein. Die Entwicklung und Produktion der AirCool-Systeme von ERS erfolgt ausschließlich in Deutschland. Das Qualitätsniveau in Verbindung mit dem fortschrittlichen Design der ERS-Produkte hat dazu geführt, dass ERS Marktanteile gewinnen konnte. Allein 2016 und 2017 stieg der Umsatz mit Thermofutter um 33 Prozent.

Pressekontakt:
Sophia Mee-Eun Oldeide
PR & MarCom
oldeide@ers-gmbh.de
+4747332776

(1) CAGR : Compound Annual Growth Rate – Durchschnittliches Wachstum pro Jahr
(2) Quelle: Fan-Out: Technologies and Market trends report, Yole Developpement, 2017
https://www.i-micronews.com/advanced-packaging-report/product/fan-out-technologies-and-market-trends-2017.html

Die ERS electronic GmbH mit Sitz in Germering bei München produziert seit 47 Jahren innovative thermische Testlösungen für die Halbleiterindustrie. Das Unternehmen hat sich einen hervorragenden Ruf in der Branche erworben, insbesondere mit seinen schnellen und präzisen Thermal-Chuck-Systemen für Testtemperaturen von -65°C bis +550°C für analytische, parametrische und Fertigungstests. Heute sind die von ERS entwickelten Thermal-Chuck-Systeme in den Produktfamilien AC3, AirCool©, AirCool© plus und PowerSense© integraler Bestandteil aller größeren Waferprober in der gesamten Halbleiterindustrie.

Firmenkontakt
ERS electronic GmbH
Sara Zanker
Stettiner Str. 3
80333 München
8989 4132-0
zanker@ers-gmbh.de
http://www.ers-gmbh.com/ers-gmbh/index.php

Pressekontakt
ERS electronic GmbH
Sophia Oldeide
Stettiner Str. 3
80333 München
8989 4132-143
oldeide@ers-gmbh.de
http://www.ers-gmbh.com/ers-gmbh/index.php

Electric Electronics

ERS appoints seasoned expert to fill new CSMO position

ERS appoints seasoned expert to fill new CSMO position

New Chief Sales and Marketing Officer at ERS electronic GmbH: Laurent Giai-Miniet (Source: Laurent Giai-Miniet)

MUNICH, 18 July, 2017 – Effective immediately, Laurent Giai-Miniet is the new Chief Sales and Marketing Officer (CSMO) at ERS electronic GmbH, the world leading provider of thermal test solutions for semiconductor manufacturing.

Laurent Giai-Miniet brings more than 25 years of experience in the semiconductor, global electronics and Internet of Things spaces. Laurent has held leadership positions at companies such as Texas Instruments and Infineon. In one of his most recent roles as CEO, Laurent Giai-Miniet successfully completed the turnaround of the energy harvesting technology leader EnOcean from a German-centric startup to a leading global provider of self-powered IoT solutions.

Laurent“s primary task will be to accelerate the company growth and increase its visibility in the global semiconductor equipment market. „I am excited to join the ERS team and I look forward to building on the foundations of a strong customer base, a talented team and a world-class product to take ERS“s business to the next level“, said Laurent Giai-Miniet.

„Laurent has an impressive track record of growing and scaling businesses“, said Klemens Reitinger, CEO of ERS electronic GmbH. „He brings with him excellent connections from across the worldwide semiconductor industry and a very good understanding of the specific needs and challenges of a growing company like ERS. I am very pleased to be working with him and to further build ERS“s business.“

Laurent holds an MBA (DESS) from the Institut d’Administration des Entreprises (IAE) of Aix-en-Provence (France) as well as an MSc in Technical Marketing of Measurement Instrumentation.

ERS electronic GmbH, based in Germering near Munich, has been producing innovative thermal test solutions for the semiconductor industry for more than 45 years. The company has gained an outstanding reputation in this sector, notably with its fast and accurate thermal chuck systems for test temperatures ranging from -65°C to +500°C for analytical, parameter-related and manufacturing tests. Today, thermal chuck systems developed by ERS with its product families AC3, AirCool©, AirCool© plus and PowerSense© are an integral component in all large-size wafer probers right across the chip industry.

Company-Contact
ERS electronic GmbH
Klemens Reitinger
Stettinerstraße 3+5
82110 Germering
Phone: +49-89-8941320
E-Mail: kreitinger@ers-gmbh.de
Url: http://www.ers-gmbh.com

Press
Brand+Image
Timothy Göbel
Von-Eichendorff-Str. 41
86911 Dießen a.A.
Phone: 08807 9475642
E-Mail: ERS@brandandimage.de
Url: http://www.brandandimage.de

Electric Electronics

New generation of Debonders and Warpage Adjusters boosts productivity

New generation of Debonders and Warpage Adjusters boosts productivity

MUNICH, April 20, 2016 – ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor production, is introducing two new innovative products. The systems are targeting the thermal debonding and warpage adjusting in eWLB (embedded Wafer Level Ball Grid Array) processes for 300/330 mm wafer processing. With their innovative features, these machines enable semiconductor manufacturers to increase both throughput and yield.

The ERS ADM330 is designed for the thermal debonding of eWLB style wafers without human intervention at high precision and with unmatched repeatability, resulting in high and predictable process quality and thus guaranteeing high yield. The two handling robots accept wafers with a maximum warpage of +/- 5 mm; after the adjustment step, the warpage is typically less than 500 µm.

With built-in OCR/BCR capabilities, the ERS ADM330 allows for automated exchange of batch parameters with process control systems through its optional SECCS/GEM interface. This enables operators to drive integration into higher-level factory IT systems one step further. Its integrated laser scribing chamber allows for continuous and complete monitoring of production-relevant data.

The ERS WAT 330 is a fully automated warpage adjust tool for 300/330 mm wafers that can handle up to four FOUPs concurrently. With its specially designed proprietary ERS Warpage Adjust Technology, also included in the ADM330, this system can form a wide variety of eWLB wafers at various processing stages. The resulting wafer shape can be matched to the handling specifications of the downstream tool.

Its three operation modes give users of the ERS WAT 330 a maximum of flexibility in high-volume production environments. The system can be used as a warpage measurement station, as a warpage adjust station or as a combined tool to measure, adjust and monitor warpage. In warpage adjust mode, the system can reduce wafer warpage from +/- 5mm to below 500 µm.

Meeting the SEMI E84 interface specifications for factory automation, both systems are future-proof with respect to next-generation digital factory concepts.

ERS electronic GmbH, based in Germering near Munich (Germany), has been producing innovative thermal test solutions for the semiconductor industry for 45 years. The company has gained an outstanding reputation in the sector, notably with its fast and accurate thermal chuck systems for test temperatures ranging from -65°C to +500°C for analytical, parameter-related and manufacturing tests. Today, thermal chuck systems developed by ERS in its product families AC3, AirCool©, AirCool© plus and PowerSense© are an integral component in all larger-sized wafer probers right across the chip industry.

Firmenkontakt
ERS electronic GmbH
Klemens Reitinger
Stettinerstraße 3+5
82110 Germering
+49-89-8941320
kreitinger@ers-gmbh.de
http://www.ers-gmbh.com

Pressekontakt
Brand+Image
Timothy Göbel
Von-Eichendorff-Str. 41
86911 Dießen a.A.
08807 9475642
ERS@brandandimage.de
http://www.brandandimage.de

Electric Electronics

ERS Competence Center celebrates fifth anniversary

High customer acceptance, rising number of application areas

ERS Competence Center celebrates fifth anniversary

(Source: ERS electronic GmbH)

MUNICH, September 27, 2016 – ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor production, looks back to five extraordinary successful years of operating its Fan-out Wafer Level Packaging (FOWL) test competence center in Munich. The center enjoys rising popularity among customers, fuelled not least by the second wave of the Advanced Packaging technology expansion that currently can be observed across the semiconductor industry.

„In retrospect, the decision to launch this Competence Center five years ago has been very fruitful and future-oriented“, says ERS Managing Director Klemens Reitinger. Though the technology has made significant progress, some fundamental issues persist – in particular those related to the proper separation of the reconstituted wafer from its temporary carrier as well as to workpiece warpage. „To both problems, we are offering solutions that can be tested in our Competence Center. Most of these solutions are based on our protected intellectual property“, Reitinger explains.

ERS observed that since 2015 the second wave of the Advanced Packaging Technology Expansion started to gain traction, triggering a significant increase in the number of market participants. OSATs (Outsourced Semiconductor Assembly and Test), material manufacturers, equipment vendors and research institutes alike are intensifying their activities in the area of embedded Wafer Level BGA (eWLB). Also, eWLB package manufacturing processes have evolved since the time the Competence Center has opened its doors. A diversity of materials and processes has unfolded. Metal, glass, silicon, diverse new potting compounds have entered the scene along with new process concepts like Chip First or RDL First. At the same time, the variety of end products and applications leveraging Advanced Packaging has grown substantially: Extremely slim smartphones, smart watches, IoT devices and even automotive products such as radar sensors are manufactured using Advanced Packaging, to name just a few examples.

The Competence Center is a significant contribution to ERS“ appeal as a leading vendor of manufacturing and development equipment. Mr. Reitinger describes the formula for success: „Strict confidentiality, no fees. Thus, we can remain open for the technological progress and can deliver results quickly and unbureaucratically.“ ERS“ reward: „Since our customers know they can trust us, we are aware of new technology trends at a very early stage. This enables us to integrate our solutions into products and manufacturing equipment more quickly.“

ERS electronic GmbH, based in Germering near Munich, has been producing innovative thermal test solutions for the semiconductor industry for 45 years. The company has gained an outstanding reputation in the sector, notably with its fast and accurate thermal chuck systems for test temperatures ranging from -65°C to +500°C for analytical, parameter-related and manufacturing tests. Today, thermal chuck systems developed by ERS in its product families AC3, AirCool©, AirCool© plus and PowerSense© are an integral component in all larger-sized wafer probers right across the chip industry.

Firmenkontakt
ERS electronic GmbH
Klemens Reitinger
Stettinerstraße 3+5
82110 Germering
+49-89-8941320
kreitinger@ers-gmbh.de
http://www.ers-gmbh.com

Pressekontakt
Brand+Image
Timothy Göbel
Von-Eichendorff-Str. 41
86911 Dießen a.A.
08807 9475642
ERS@brandandimage.de

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Electric Electronics

ERS showcases Thermal Chuck and eWLB Test Product Line-up at Semicon Taiwan

Semicon Taiwan: Booth 2522, 1st floor

ERS showcases Thermal Chuck and eWLB Test Product Line-up at Semicon Taiwan

(Source: ERS electronic GmbH)

MUNICH, September 1, 2016 – ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor production, will showcase its product line at the Semicon Taiwan trade fair (September 7 – 9). At the exhibition, ERS shares its stand with its sales partner Chain Logic International Corp. (CLIC), highlighting the trusting and fruitful cooperation between ERS and CLIC.

ERS Asia General Manager Harald Ibele will be attending the event on behalf of ERS and is available to meet for any questions regarding wafer probe or eWLB style warpage adjust equipment and processes. „This joint exhibition presence highlights the trusting and fruitful cooperation between ERS and CLIC“, said Ibele. „With the proven quality of our products and services we will continue our successful relationship.“

ERS excels in high accuracy, low noise thermal chucks for high-end wafer test for technologically demanding segments of the semiconductor industry such as the automotive, medical and aerospace markets as well as R&D.

Semicon Taiwan is the premiere event for the semiconductor industry in Asia, bringing together manufacturers, suppliers and business customers from all over the world. Taiwan is known for having the largest concentration of foundries and test houses globally. With its current line-up of technologically advanced test solutions, ERS, together with its distribution partner Chain Logic, is extremely well positioned to break into this demanding market. ERS“ latest developments in the field of Thermal Wafer Chucks will take center stage at the company“s exhibits in booth 2522, 1st floor.

Semicon Taiwan, one of the largest events of its kind around the globe, is expected to attract 43.000 visitors and 3.300 program participants; more than 700 exhibitors from all over the world will showcase their products in 1600+ booths.

ERS electronic GmbH, based in Germering near Munich, has been producing innovative thermal test solutions for the semiconductor industry for 45 years. The company has gained an outstanding reputation in the sector, notably with its fast and accurate thermal chuck systems for test temperatures ranging from -65°C to +500°C for analytical, parameter-related and manufacturing tests. Today, thermal chuck systems developed by ERS in its product families AC3, AirCool©, AirCool© plus and PowerSense© are an integral component in all larger-sized wafer probers right across the chip industry.

Firmenkontakt
ERS electronic GmbH
Klemens Reitinger
Stettinerstraße 3+5
82110 Germering
+49-89-8941320
kreitinger@ers-gmbh.de
http://www.ers-gmbh.com

Pressekontakt
Brand+Image
Timothy Göbel
Von-Eichendorff-Str. 41
86911 Dießen a.A.
08807 9475642
ERS@brandandimage.de

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Electric Electronics

ERS ready for imminent eWLB upswing

Emerging semiconductor manufacturing technology

ERS ready for imminent eWLB upswing

(Source: ERS electronic GmbH)

MUNICH, August 2, 2016 – ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor production, sees excellent growth opportunities in the emerging eWLB / FOWLP (Fan Out Wafer Level Packaging) advanced packaging technology. ERS expects this market to grow at a pace of more than 30 per cent annually – and ERS is extremely well positioned to benefit from this situation.

eWLB (Embedded Wafer-Level Ball Grid Array) is a very economical packaging technology for the advanced semiconductor solutions required for innovative application areas such as Internet of Things, sensors, automation and mobility. It enables semiconductor manufacturers to create chips with smaller footprint, thinner package and better electrical properties than possible with conventional flip-chip BGA packaging. Therefore it is a crucial technology to create space-saving yet powerful solutions. Since this technology is already proven in mass production at renowned semiconductor manufacturers and offers substantial technological and cost benefits, it can be expected that it will reach a very high popularity throughout the entire semiconductor industry.

Due to its world-leading thermal expertise, ERS has been involved in the development of this technology from its inception. For more than six years, ERS“ equipment is deployed in the most demanding mass-production environments at leading semiconductor manufacturers and OSATS worldwide. For this reason, ERS has a unique position in the emergent dynamic market for eWLB manufacturing equipment and will fully benefit from the rising demand for such equipment. With its sound experience in thermal treatment as well as in eWLB manufacturing processes, ERS can support manufacturers to get their processes stable and economic and can adapt its equipment quickly to new requirements.

On the basis of this unique set of capabilities and expertise, ERS has won two major customers in this global market within only six months. Through its eWLB Competence Center, located at the ERS headquarters near Munich, ERS is actively involved into further developing the technology. This enables the company to quickly react on changing market and technology conditions. Even more important, through this Competence Center ERS is an active eWLB technology player and has immediate access to all new developments from their beginning.

ERS electronic GmbH, based in Germering near Munich, has been producing innovative thermal test solutions for the semiconductor industry for 45 years. The company has gained an outstanding reputation in the sector, notably with its fast and accurate thermal chuck systems for test temperatures ranging from -65°C to +500°C for analytical, parameter-related and manufacturing tests. Today, thermal chuck systems developed by ERS in its product families AC3, AirCool©, AirCool© plus and PowerSense© are an integral component in all larger-sized wafer probers right across the chip industry.

Firmenkontakt
ERS electronic GmbH
Klemens Reitinger
Stettinerstraße 3+5
82110 Germering
+49-89-8941320
kreitinger@ers-gmbh.de
http://www.ers-gmbh.com

Pressekontakt
Brand+Image
Timothy Göbel
Von-Eichendorff-Str. 41
86911 Dießen a.A.
08807 9475642
ERS@brandandimage.de

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