Tag Archives: Electronics

Electric Electronics

ZETTLER electronics at electronica 2016

Showcasing the full range of components, including innovative solar-power relays, displays and switching power supplies

ZETTLER electronics at electronica 2016

Munich, Germany, September 20, 2016 – At electronica 2016, ZETTLER electronics GmbH (http://www.zettlerelectronics.com/) will showcase its full range of products. The manufacturer and distributor of electromagnetic and electronic components will once again be present at the ZETTLER Group (http://www.zettler-group.com/) booth (Hall A2/655). Here, ZETTLER will be demonstrating the full breadth of its extensive know-how in the business areas: Relays, Displays, Magnetics und Controls.

– Relays: Innovative product lines of high-grade, cost-efficient components for the modern industry and consumer electronics, e.g., automotive relays, signal relays as well as special relays for highly specific applications and switching power supplies.

With its wide range of powerful solar relays (e.g., AZSR180) ZETTLER electronics is responding to continually increasing need for inverter-design driven specifications related to physical size, energy efficiency and relay safety features.

– Displays: ZETTLER will also introduces its portfolio of innovative TFT panels with capacitive touch technology, LCD modules as well as PMLCD and OLED. The wide spectrum of TFT Modules is made for numerous applications such as Avionics, Medical, Navigation Systems, Industrial Controls, Irrigation Controls, Testing/Measurement devices and Smart Metering.

– Magnetics: A variety of top quality winding goods will be presented, e.g., transformers, chokes, coils as well as switched-mode power supply modules for PCB mounting.
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– Controls: The controls portfolio offers industry leading and highly specialized support services to the HVAC/R market with a comprehensive product line, including relays, contactors and bimetal thermostatic switches.

„At electronica, ZETTLER electronics can fully demonstrate its extensive know-how and experience in the field of electromagnetic and electronic components“, explains Alexander Stöckel, Productmanagement Electromechanical Components at ZETTLER electronics. „Our shared booth with ZETTLER Group showcases our full service capabilities. We provide solutions for component applications across the industrial and commercial markets and a broad spectrum of other industries. Our products inspire innovation and support engineers from the design through to production phase.“

Download of High-Quality Images: ZETTLER electronics Booth (http://www.lucyturpin.de/PR/Zettler/2016/Images/ZETTLER_electronica2014.JPG)

Further Information on ZETTLER electronics:
– ZETTLER electronic Website (http://www.zettlerelectronics.com/cms/front_content.php?idcat=5&lang=2)
– Video ZETTLER Relays Production Line (http://www.zettlerelectronics.com/cms/front_content.php?idcat=122)
– ZETTLER Group Website (http://www.zettler-group.com/home/)

Building on more than a century of expertise in German precision engineering, ZETTLER GROUP is a world-class enterprise, engaged in the design, manufacturing, sales and distribution of electronic components. Its industry leadership is based on a unique combination of engineering competence and global scale. ZETTLER GROUP“s diversified product lines are designed to provide complete solutions for component applications across a broad spectrum of industries, including relays, magnetics, displays, controls and new energy solutions. With a global network of companies ZETTLER GROUP is not only present in low cost manufacturing geographies, but also has the ability to provide customer-focused solutions in proximity to local industrial and commercial markets. Located near Munich, Germany, ZETTLER Electronics GmbH serves as the European headquarters for ZETTLER Group and operates through a comprehensive network of distributors across nineteen countries, including all the key markets of the European Union, Scandinavia, Israel, and Turkey.

Firmenkontakt
Zettler electronics GmbH
Alexander Stöckel
Junkersstr. 3
82178 Puchheim (München)
+49 89-800-97-0
Alexander.Stoeckel@ZETTLERelectronics.com
www.zettlerelectronics.com

Pressekontakt
Lucy Turpin Communications GmbH
Birgit Fuchs-Laine
Prinzregentenstrasse 79
81675 München
+49 (0)89 – 41 77 61 – 13
zettler@lucyturpin.com
www.lucyturpin.com

Business Economy Finances

Young professionals with a passion for technology meet SKIDATA as part of Salzburg’s Summer IT Week

SKIDATA opens the doors of the IT branch to new recruits

Young professionals with a passion for technology meet SKIDATA as part of Salzburg

Participants Summer IT Week @SKIDATA

During the Summer IT Week from July 25-29, 2016, everything in Salzburg was dedicated to supporting young people. The goal: getting up-and-comers in the workforce excited about the IT industry and to illustrate the variety of this professional field. SKIDATA presented multi-faceted opportunities for development and gave interested young men and women the chance to get a closer look at one of Salzburg’s most successful companies. Events like the Summer IT Week are not only advantageous for participants, but they also give companies the chance to motivate young professionals for a job in their branch.

Innovative access solutions and ticketing systems from SKIDATA – a first look for Summer IT Week participants

Interested IT Week participants learned about various careers, including the variety of apprenticeships at SKIDATA, through workshops and company visits. Before things got started, participants had the opportunity to fill up in the SKIDATA cafeteria. There were many interesting looks at different apprenticeships during the Summer IT Week company visit. Participants also tested innovative access solutions and ticket systems themselves and learned about the technology inside. The inquisitive young participants got a better look at a software developer’s everyday worklife and learned how a computer is built. The importance of data encryption was also among the topics discussed.

„surprisingly convincing“ – apprenticeships with a future at SKIDATA

Finding your own strengths and putting your talent to use is one of the most important objectives of an apprenticeship at SKIDATA. Here apprentices are valued as fully-fledged members of the company from their first day on and therefore also have the opportunity to completely get involved. The range of training offers young trainees the best perspectives for their futures. As a state-approved apprenticeship company, SKIDATA offers apprenticeships in the following skilled trades:

-Electronics technician – applied electronics
-Mechatronic technician
-Information technologies – technician
-Information technologies – computer specialist
-Office administrator
-Media specialist – media design
-Operating logistics clerk

SKIDATA at career events – innovation up-close
At SKIDATA it is especially important to meet young professionals and potential new employees personally. Sophie Fürst from our Human Resources department says, „We take the opportunity at career events to establish new contacts and present our company and what it’s like to work at SKIDATA. Our company culture is best conveyed through personal discussions.“

Meet SKIDATA! Upcoming events:
October 20, 2016: FH NEXT (University of Applied Sciences Upper Austria, Hagenberg campus)
November 14, 2016: MCI Recruiting Forum (MCI Management Center Innsbruck)
November 15, 2016: CONNECT 2016 (Alpen Adria Universität Klagenfurt)

Find current job openings and more information about working at SKIDATA by visiting http://www.skidata.com/en/career.html

SKIDATA is an international leading company for access solutions and management. Nearly 10,000 SKIDATA installations in ski resorts, shopping centers, major airports, communities, sports stadiums, exhibition centers and amusement parks worldwide ensure safe and reliable access control for people and vehicles. SKIDATA places great value in offering solutions that are intuitive, easy to operate and secure. With their integrated concepts, SKIDATA solutions help clients optimize performance and maximize profits. The SKIDATA Group (www.skidata.com) is a member of the publicly traded Swiss Kudelski Group (www.nagra.com), a leading provider of digital security solutions.

Kontakt
SKIDATA AG
Mag. Belkis Etz
Untersbergstraße 40
5083 Grödig bei Salzburg
+43 6246 888-0
jobs@skidata.com
http://www.skidata.com/en/career.html

Electric Electronics

Wide Contact Gap Solar Relay: ZETTLER electronics‘ 80 A High Power PCB Relay

High power PCB relay with wide contact gaps and patented thermal bridge to meet higher isolation requirements and prevent critical overheating in PV applications

Wide Contact Gap Solar Relay: ZETTLER electronics

Munich, Germany, June 16, 2016 – The ZETTLER electronics GmbH (http://www.zettlerelectronics.com/), a manufacturer and distributor of electromagnetic and electronic components, has announced the availability of its new single pole 80 A solar relay. The innovative AZSR180 series is designed for the photovoltaic industry, to fulfill solar inverter and other application requirements.

Developed for PV applications of up to 20kVA (single phase) / 55kVA (three phase), this high power PCB relay is well suited for medium sized to larger roof top-based as well as commercial systems, deployable up to 4,000 meters above sea level. It can handle 80 A current at an energy efficient holding power of only 100 mW and offers a dielectric strength of 5,000 Vrms. The wide contact gap (> 2.05 mm) and large isolation spacing (> 10 mm) support extended requirements for use in photovoltaic applications.

A special feature of AZSR180 is a thermally-conductive copper bridge that connects the two parallel contact springs for level distribution of any excessive heat between the two contacts. Even in an extremely seldom case of a total failure of one of the two parallel-connected contacts, this „thermal bridge“ prevents critical overheating of the latter contact and thus relay destruction.

With the AZSR180, Zettler has demonstrated its commitment to continue expanding its wide range of innovative AC side solar relays. The company is responding to ever-increasing inverter-design driven specifications related to physical size, energy efficiency and relay safety features. In parallel, it is also meeting demands for higher isolation requirements (e. g., IEC 62109 and UL 62109), as well as higher kVA capacities and switching currents.

For a complete listing of Zettler“s relay solutions please visit the website (http://www.zettlerelectronics.com/cms/front_content.php?idart=9). For technical information and preliminary datasheets please contact ZETTLER electronics GmbH (http://www.zettlerelectronics.com/cms/front_content.php?idart=9).

Contact data
– Max. switched / continuous current80 A
– Max. switched power2,400 W or 22,160 VA
– Max. switched voltage150 VDC or 440 VAC
– Rated load 80 A at 277 VAC, resistive
– Contact gap > 2.05 mm

Coil data
– Power at pickup voltage (typical)270 mW
– Power max. continuous dissipation2.0 W at 20° C (68° F) ambient
– Power temperature rise15° C (27° F) at nominal coil voltage

Isolation data
– Dielectric strength 5,000 Vrms coil to contact / 2,500 Vrms between open contacts
– Isolation spacing> 10 mm
– Reinforced isolationEN 60730-1 (VDE 0631, part1), EN 60335-1 (VDE 0700, part1)

Mechanical
– Ambient temperature -40° C (-40° F) to 85° C (185° F)
– Vibration0.062″ (1.5 mm) DA at 10-55 Hz
– Shock10 g

Building on more than a century of expertise in German precision engineering, ZETTLER GROUP is a world-class enterprise, engaged in the design, manufacturing, sales and distribution of electronic components. Its industry leadership is based on a unique combination of engineering competence and global scale. ZETTLER GROUP“s diversified product lines are designed to provide complete solutions for component applications across a broad spectrum of industries, including relays, magnetics, displays, controls and new energy solutions. With a global network of companies ZETTLER GROUP is not only present in low cost manufacturing geographies, but also has the ability to provide customer-focused solutions in proximity to local industrial and commercial markets. Located near Munich, Germany, ZETTLER Electronics GmbH serves as the European headquarters for ZETTLER Group and operates through a comprehensive network of distributors across nineteen countries, including all the key markets of the European Union, Scandinavia, Israel, and Turkey.

Firmenkontakt
Zettler electronics GmbH
Alexander Stöckel
Junkersstr. 3
82178 Puchheim (München)
+49 89-800-97-0
Alexander.Stoeckel@ZETTLERelectronics.com
www.zettlerelectronics.com

Pressekontakt
Lucy Turpin Communications GmbH
Birgit Fuchs-Laine
Prinzregentenstrasse 79
81675 München
+49 (0)89 – 41 77 61 – 13
zettler@lucyturpin.com
www.lucyturpin.com

Elektronik Medien Kommunikation

Now available: ZETTLER electronics General Purpose Miniature Power Relay AZ576

New electromechanical relay series shows best-in-class performance ratings for applications in appliance, lighting, controls and similar industries

Now available: ZETTLER electronics General Purpose Miniature Power Relay AZ576

Munich, Germany, March 1st, 2016 – The ZETTLER electronics GmbH , a manufacturer and distributor of electromagnetic and electronic components, introduces its new AZ 576 relay series. Designed for applications in the appliance, lighting, controls and similar industries, the miniature power relay meets the ever increasing demands for more power, more cycles and higher ambient temperatures.

Establishing best-in-class standards in terms of UL performance the 20 A power relay solution performs at 277 VAC at an ambient temperature up to 85° C (185° F) with ratings of 20 A for 30 k cycles. At 105° C (221° F) it has ratings of 17 A for 100 k cycles (1 Form A) as well as for 30 k cycles (1 Form C). Coil voltages range from 3 to 110 VDC. At nominal coil voltage operate time is typically less than 8 ms with release time of typically less than 4 ms. Pin spacing is an industry-standard (5.0 mm). General purpose, pilot duty, HP, inductive, and TV loads round out the top UL ratings. A 5kV coil-contact dielectric strength and a 10kV surge resistance ensure that the AZ576 is robust enough for even highly susceptible applications.

Class F insulation (155° C / 311° F) is standard. Additionally, the relay is available in an epoxy sealed version allowing reliable usage in demanding environments. Its low height of 16.2 mm and its standard frame as well as the standard contact layout qualifies the relay for use in different applications for a number of industries, including industry electronics, home and HVAC appliances and vending machines.

With the AZ 576 Zettler provides cost-efficient alternatives to its already existing monostable relay series AZ 762 and AZ 764. For a complete listing of Zettler“s power relay solutions please visit the website . For technical information and datasheets please contact ZETTLER electronics GmbH.

(Download of high-resolution image)

Key Benefits
– Ambient temperature up to 105° C (221° F)
– Monostable power relay for net loads
– UL, CUR file E44211
– Standard frame and contact for general purpose applications

Applications
– Industry electronics
– Home appliances
– Vending machines
– HVAC appliances

Availability:
Immediately ( Download Datasheet )

Contacts data
– Arrangement
SPDT (1 Form C)
SPST (1 Form A)
– Max. switched power: 510 W or 5540 VA
– Max. switched current: 20 A
– Max. switched voltage: 30 VDC or 277 VAC
– Rated load
20 A at 277 VAC, resistive, 85° C (185° F), 30 k cycles
17 A at 277 VAC, resistive, 105° C (221° F), 100 k cycles (1 Form A)
17 A at 277 VAC, resistive, 105° C (221° F), 30 k cycles (1 Form C)

Coil data
-Power at pickup voltage (typical): 225 mW
-Power max. continuous dissipation: 1.7 W at 20° C (68° F) ambient
-Power temperature rise: 26° C (47° F) at nominal coil voltage
-Max. temperature: max. 155° C (311° F) Class F

Isolation data
-Dielectric strength: 5,000 Vrms coil to contact / 1,000 Vrms between open contacts
-Isolation resistance: 1,000 M min. at 20° C (68° F), 500 VDC, 50% RH

Mechanical
-Ambient temperature: -40° C (-40° F) to 105° C (221° F)
-Vibration: 0.062″ (1.5 mm) DA at 10-55 Hz
-Shock: 10 g

Building on more than a century of expertise in German precision engineering, ZETTLER GROUP is a world-class enterprise, engaged in the design, manufacturing, sales and distribution of electronic components. Its industry leadership is based on a unique combination of engineering competence and global scale. ZETTLER GROUP“s diversified product lines are designed to provide complete solutions for component applications across a broad spectrum of industries, including relays, magnetics, displays, controls and new energy solutions. With a global network of companies ZETTLER GROUP is not only present in low cost manufacturing geographies, but also has the ability to provide customer-focused solutions in proximity to local industrial and commercial markets. Located near Munich, Germany, ZETTLER Electronics GmbH serves as the European headquarters for ZETTLER Group and operates through a comprehensive network of distributors across nineteen countries, including all the key markets of the European Union, Scandinavia, Israel, and Turkey.

Firmenkontakt
Zettler electronics GmbH
Alexander Stöckel
Junkersstr. 3
82178 Puchheim (München)
+49 89-800-97-0
Alexander.Stoeckel@ZETTLERelectronics.com
www.zettlerelectronics.com

Pressekontakt
Lucy Turpin Communications GmbH
Birgit Fuchs-Laine
Prinzregentenstrasse 79
81675 München
+49 (0)89 – 41 77 61 – 13
zettler@lucyturpin.com
www.lucyturpin.com

Automotive Traffic

MOST® and AUTOSAR

MOST Forum 2015: MOST Cooperation Will Present the Integration of AUTOSAR within the MOST Network

MOST® and AUTOSAR

Integration of AUTOSAR within the MOST Network

The MOST® Cooperation – standardization organization for the leading automotive multimedia network technology Media Oriented Systems Transport (MOST) – will present an implementation of MOST within the AUTOSAR framework at the upcoming MOST Forum on April 21, 2015 in Stuttgart/Esslingen (Germany). AUTOSAR (AUTomotive Open System Architecture, www.autosar.org) has developed a standardized open software architecture for automotive electronic control units and is increasingly being applied in traditional vehicle electronics domains. MOST, on the other hand, is an important standard for automotive infotainment. „MOST Technology is used to connect various domains in the vehicle, and is compatible with many different standards such as AUTOSAR,“ stated Dr. Wolfgang Bott, Technical Coordinator of the MOST Cooperation. „There are several cases where it is useful for MOST and AUTOSAR to interoperate.“

A demonstrator will show a MOST/AUTOSAR gateway that connects the vehicle network with a MOST network using AUTOSAR mechanisms. In a second approach, the communication of two AUTOSAR applications is tunneled through a MOST network, either through the MOST Control Channel or over the MOST Ethernet Channel.

About MOST Technology
MOST (Media Oriented Systems Transport) is a multimedia networking technology optimized for use in cars and other applications. It enables the transport of high Quality of Service audio and video together with packet data and real-time control over a single transmission medium. MOST can use plastic optical fibers (POF), coax based electrical physical layer, and shielded and unshielded twisted pair (STP/UTP) copper wires that meet automotive environmental requirements. Today, MOST is used in over 170 car models as the communication backbone for their information and entertainment equipment.

About MOST Cooperation
The MOST Cooperation (MOSTCO) is the organization through which MOST Technology is standardized and refined so that it continues to stay abreast of the latest industry requirements. Today, it consists of 17 international carmakers and over 55 key component suppliers. They have joined together to work with the MOST Technology and to contribute to its innovation. The MOST Cooperation is prepared to embrace efforts to further develop and standardize the technology for other industries and to establish the corresponding work structures. The MOST Cooperation was founded in 1998 to standardize MOST Technology as a global standard for multimedia networking. Audi, BMW, Daimler, HARMAN and Microchip Technology are its core partners and constitute its Steering Committee. For more information see http://www.mostcooperation.com.

Firmenkontakt
MOST Cooperation
Mandy Ahlendorf
Bannwaldallee 48
76185 Karlsruhe
+49 8151 9739098
mostco_pr@mostcooperation.com
http://www.mostcooperation.com

Pressekontakt
ahlendorf communication
Mandy Ahlendorf
Schiffbauerweg 5F
82319 Starnberg
+4981519739098
ma@ahlendorf-communication.com
www.ahlendorf-communication.com

Electric Electronics

Fujitsu Semiconductor and Rohde & Schwarz Extend Long-Standing Cooperation for Customized SoCs

Parties signed contract for development of a 28nm System on Chip for Rohde & Schwarz test and measurement instruments

Fujitsu Semiconductor and Rohde & Schwarz Extend Long-Standing Cooperation for Customized SoCs

Fujitsu Semiconductor and Rohde & Schwarz extend long-standing cooperation.

Langen & Munich, Germany, February 16, 2015 – Fujitsu Semiconductor Europe (FSEU) and Rohde & Schwarz (R&S) signed a contract to extend their long-standing cooperation. The partnership will focus on developing a customized System on Chip (SoC) using a production technology of 28nm. This SoC will be used in Rohde & Schwarz test and measurement instruments. FSEU“s expertise in the area of leading semiconductor design, especially in the area of application-specific integrated circuits (ASICs) is the foundation of this long-standing partnership of more than ten years.

Roland Steffen, Executive Vice President and Head of Test and Measurement Division at Rohde & Schwarz, comments: „Our instruments and test systems set new standards in research, development, production and service worldwide. To keep and develop this position we need a strong and reliable technology partner. In FSEU we found such a partner who has proven its expertise and capabilities in developing state-of-the-art ASICs tailored to our needs and those of our customers.“

Brendan Mc Kearney, President at Fujitsu Semiconductor Europe, states: „FSEU is proud to be part of this sophisticated high end technology co development project. Our team of dedicated design and implementation engineers will work closely together with Rohde & Schwarz to leverage FSEU“s ASIC expertise and experience and bring an industry-leading test and measurement platform to life.“

Über Fujitsu Semiconductor Europe (FSEU)

Seit 1980 bedient Fujitsu Semiconductor Europe (FSEU) die Märkte Automotive, Industrial, Communications und Home Entertainment. Das Unternehmen mit Hauptsitz in Langen bei Frankfurt ist einer der wichtigsten Zulieferer von \\\\\\\“Right-Sized\\\\\\\“ und fortschrittlichen Halbleiterlösungen. Mit dieser Vision entwickelt FSEU nicht nur maßgeschneiderte Produkte für modernste Anwendungen, sondern bietet über seine Niederlassungen in ganz Europa und die eigene Software-Tochter (FEAT) im österreichischen Linz ausgezeichnete technische Dienstleistungen und Unterstützung an. FSEU hat das Ziel, ein integraler Bestandteil in der Lieferkette seiner Kunden zu sein. In den Design-Zentren sowie Forschungs- und Entwicklungseinrichtungen von Fujitsu, die sich analoger und Mixed-Signal-Technologie, Advanced Packaging, Grafikcontrollern, Multimedia ICs, kundenspezifischen SoCs (ASICs) und Embedded Software widmen, arbeiten die Ingenieure von FSEU eng mit den Marketing- und Vertriebsteams der Kunden in der EMEA-Region zusammen, um den Anforderungen der Kunden an deren Systementwicklung gerecht zu werden.

Unternehmenswebsite: http://emea.fujitsu.com/semiconductor
Newsletter: http://emea.fujitsu.com/newsletter
Twitter: http://emea.fujitsu.com/twitter

Firmenkontakt
Fujitsu Semiconductor Europe GmbH
Mark Ellins
Pittlerstr. 47
63225 Langen
06103-6900
mark.ellins@de.fujitsu.com
http://emea.fujitsu.com/semiconductor

Pressekontakt
Hotwire
Florian Hohenauer
Franziska-Bilek-Weg 9
80339 München
+49 (0)89 210932-74
florian.hohenauer@hotwirepr.com
http://www.hotwirepr.com

Electric Electronics

Photokina 2014: Leica and Fujitsu Semiconductor Extend Long-Standing Cooperation Focusing on Next Generation SoC

Photokina 2014: Leica and Fujitsu Semiconductor Extend Long-Standing Cooperation Focusing on Next Generation SoC

Leica and Fujitsu Semiconductor sign letter of intent on photokina 2014 to extend cooperation.

Parties sign letter of intent on photo trade fair, will extend longstanding development relationship

Langen, Germany, September 18, 2014 – Leica Camera AG („Leica“) and Fujitsu Semiconductor Europe (FSEU) today signed a letter of intent, expressing their plans to extend their longstanding cooperation. The partnership will focus on developing next generation System on Chips (SoC) for Leica“s leading-edge digital cameras for professional use. FSEU“s expertise in the area of leading semiconductor design, and especially in the area of digital camera image processor SoC, already resulted in the successful development of two generations of Camera SOCs.

Both companies have an ongoing cooperation since 2008. At Photokina 2014, they presented its latest result, a new Leica S camera that features the Leica MAESTRO II image processor. Small medium-format cameras such as the Leica S-System offer excellent imaging quality and user experiences due to the high-definition imagery, fast processing speeds, and low power consumption that the Fujitsu Milbeaut series of image processing devices for cameras is able to provide.

Markus Limberger, Chief Operating Officer in the Leica Camera board, comments: „In FSEU, we have found a strong and reliable technology partner who has proven its expertise and capabilities for state-of-the-art imaging solutions over the years in the context of our cooperation. We are highly committed on fostering this relationship. As expressed in the letter of intent, Leica will, subject to availability and commercial and technological fit, solely use FSEU products of this type of SoC for its professional camera solutions.“

Inoue Amane, Corporate Senior Vice President and President of System LSI Company at Fujitsu Semiconductor Limited comments: „FSEU will fully support Leica“s requirements while developing the next generation SoC Maestro III and respective firmware. Our team of dedicated hardware and software engineers will continue merging the strengths of FSEU“s image-processing technologies with Leica“s high-definition imaging technologies and offer an industry-leading image processing solution.“ By signing the letter of intent, FSEU also commits on using a production technology of 28nm or better for future developments and providing samples to Leica as early as possible, allowing Leica a quick development.

Über Fujitsu Semiconductor Europe (FSEU)

Seit 1980 bedient Fujitsu Semiconductor Europe (FSEU) die Märkte Automotive, Industrial, Communications und Home Entertainment. Das Unternehmen mit Hauptsitz in Langen bei Frankfurt ist einer der wichtigsten Zulieferer von „Right-Sized“ und fortschrittlichen Halbleiterlösungen. Mit dieser Vision entwickelt FSEU nicht nur maßgeschneiderte Produkte für modernste Anwendungen, sondern bietet über seine Niederlassungen in ganz Europa und die eigene Software-Tochter (FEAT) im österreichischen Linz ausgezeichnete technische Dienstleistungen und Unterstützung an. FSEU hat das Ziel, ein integraler Bestandteil in der Lieferkette seiner Kunden zu sein. In den Design-Zentren sowie Forschungs- und Entwicklungseinrichtungen von Fujitsu, die sich analoger und Mixed-Signal-Technologie, Advanced Packaging, Grafikcontrollern, Multimedia ICs, kundenspezifischen SoCs (ASICs) und Embedded Software widmen, arbeiten die Ingenieure von FSEU eng mit den Marketing- und Vertriebsteams der Kunden in der EMEA-Region zusammen, um den Anforderungen der Kunden an deren Systementwicklung gerecht zu werden.

Unternehmenswebsite: http://emea.fujitsu.com/semiconductor
Newsletter: http://emea.fujitsu.com/newsletter
Twitter: http://emea.fujitsu.com/twitter

Firmenkontakt
Fujitsu Semiconductor Europe GmbH
Herr Mark Ellins
Pittlerstr. 47
63225 Langen
06103-6900
mark.ellins@de.fujitsu.com
http://emea.fujitsu.com/semiconductor

Pressekontakt
Hotwire
Florian Hohenauer
Franziska-Bilek-Weg 9
80339 München
+49 (0)89 210932-74
florian.hohenauer@hotwirepr.com
http://www.hotwirepr.com

Electric Electronics

Photokina 2014: Leica to Present New High-End Camera Leica S Featuring Leica MAESTRO II Processor built on Fujitsu Technology

Photokina 2014: Leica to Present New High-End Camera Leica S Featuring Leica MAESTRO II Processor built on Fujitsu Technology

Leica to present new Leica S high-end camera featuring Leica MAESTRO II image processor at Photokina

Joint presence at leading photo trade fair from September 16 – 21, 2014, underscores longstanding development relationship

Langen, Germany, September 16, 2014 – Leica Camera AG („Leica“) and Fujitsu Semiconductor Europe (FSEU) will be presenting a new Leica S camera that features the Leica MAESTRO II image processor at the Photokina exhibition to be held in Cologne, Germany, from September 16 – 21 (booth A002, hall 01.1). The Leica S-System is a purely digital high-end camera system built for professional photographers. Small medium-format cameras offer excellent imaging quality and user experiences due to the high-definition imagery, fast processing speeds, and low power consumption that the Fujitsu Milbeaut series of image processing devices for cameras is able to provide.

Leica MAESTRO II has been built upon the latest technology from Fujitsu“s Milbeaut series. It features improved image processing algorithms and faster CPUs. The combined faster operation of both software and hardware enables superior image processing performance.

The joint presence at Photokina underscores the longstanding and successful relationship between Leica and FSEU.

Fujitsu Milbeaut series
Due to increasingly higher requirements with respect to image quality, demand for faster image processing systems, which at the same time guarantee low power consumption, continues to grow. Widely used in digital single-lens reflex (SLR), compact digital still, and mobile phone cameras, the Milbeaut series meets current market demands. Fujitsu Milbeaut technology offers various image processing and interface functions on a single chip as required by these cameras, including video and audio support.

Dr. Volker Zimmer, Head of the Digital Imaging Division of Leica, commented, „Leica delivers cutting-edge technology to professional photographers around the world. Therefore, we rely on strong technology partners such as Fujitsu who provide us with state-of-the-art imaging solutions. MAESTRO II will deliver excellent performance for our key customers.“

Strategic cooperation
In 2008, Leica and FSEU introduced a co-developed image processing system solution for high-end digital SLR cameras to be featured in Leica“s next generation cameras. For this joint development, Leica and FSEU established a team of dedicated hardware and software engineers to leverage the company“s expertise and know-how. By combining the strengths of FSEU“s image-processing Milbeaut technologies with Leica“s high-definition imaging technologies, the companies offer an industry-leading image processing solution that is also featured in the new Leica S.

„Solutions like the Leica MAESTRO II image processor presented at Photokina are the result of a long-standing development partnership with Leica,“ said Markus Mierse, Senior Director of the Imaging Business Unit of FSEU. „We will be building on this successful cooperation to keep delivering outstanding high-end cameras that combine Leica“s expertise and reputation in the camera industry with our Milbeaut image processing LSI technology.“

About Leica Camera
Leica Camera AG is an internationally operating, premium-segment manufacturer of cameras and sport optics products. The legendary status of the Leica brand is founded on a long tradition of excellence in the construction of lenses. Combined with innovative technologies, Leica products continue to guarantee better pictures in all situations in the worlds of visualisation and perception to this day. Leica Camera AG has its headquarters in Wetzlar, in the state of Hesse in Germany, and a second production site in Vila Nova de Famalicão, Portugal. The company operates branch offices in England, France, Japan, Singapore, Switzerland, South Korea, Italy, Australia and the USA. New and innovative products have been the driving force behind the company’s positive development in recent years. For more information, please see: http://en.leica-camera.com/home/

Über Fujitsu Semiconductor Europe (FSEU)

Seit 1980 bedient Fujitsu Semiconductor Europe (FSEU) die Märkte Automotive, Industrial, Communications und Home Entertainment. Das Unternehmen mit Hauptsitz in Langen bei Frankfurt ist einer der wichtigsten Zulieferer von ‘Right-Sized’ und fortschrittlichen Halbleiterlösungen. Mit dieser Vision entwickelt FSEU nicht nur maßgeschneiderte Produkte für modernste Anwendungen, sondern bietet über seine Niederlassungen in ganz Europa und die eigene Software-Tochter (FEAT) im österreichischen Linz ausgezeichnete technische Dienstleistungen und Unterstützung an. FSEU hat das Ziel, ein integraler Bestandteil in der Lieferkette seiner Kunden zu sein. In den Design-Zentren sowie Forschungs- und Entwicklungseinrichtungen von Fujitsu, die sich analoger und Mixed-Signal-Technologie, Advanced Packaging, Grafikcontrollern, Multimedia ICs, kundenspezifischen SoCs (ASICs) und Embedded Software widmen, arbeiten die Ingenieure von FSEU eng mit den Marketing- und Vertriebsteams der Kunden in der EMEA-Region zusammen, um den Anforderungen der Kunden an deren Systementwicklung gerecht zu werden.

Unternehmenswebsite: http://emea.fujitsu.com/semiconductor
Newsletter: http://emea.fujitsu.com/newsletter
Twitter: http://emea.fujitsu.com/twitter

Firmenkontakt
Fujitsu Semiconductor Europe GmbH
Herr Mark Ellins
Pittlerstr. 47
63225 Langen
06103-6900
mark.ellins@de.fujitsu.com
http://emea.fujitsu.com/semiconductor

Pressekontakt
Hotwire
Florian Hohenauer
Franziska-Bilek-Weg 9
80339 München
+49 (0)89 210932-74
florian.hohenauer@hotwirepr.com
http://www.hotwirepr.com

Elektronik Medien Kommunikation

Fujitsu stellt SoC-Baustein für die HEVC-HD-Decodierung in Multimedia-Anwendungen vor

Das SoC unterstützt H.265-Decodierung für Set-Top-Boxen und In-Car-Infotainmentsysteme

Fujitsu stellt SoC-Baustein für die HEVC-HD-Decodierung in Multimedia-Anwendungen vor

Fujitsu stellt SoC-Baustein für die HEVC-HD-Decodierung (H.265) für Multimedia-Anwendungen vor.

Langen, 26. August 2014 – Fujitsu Semiconductor Europe (FSEU) stellt mit dem MB8AL2030 – Rufname HD62 – eine aktuelle Erweiterung der H6x-Decoderserie vor. Das System on Chip (SoC) unterstützt die HEVC-Decodierung, auch bekannt als H.265-Decodierung, in HD-Auflösung für Multimedia-Anwendungen in In-Car-Infotainment- und Home-Entertainment-Systeme. H.265 ist der Nachfolger des weit verbreiteten Videostandards H.264. Mit H.265 lässt sich die Komprimierung im Vergleich zum Vorgänger noch einmal verdoppeln.

HD62 bietet zudem einen H.264-Encoder und unterstützt eine 3D-Grafik-Engine, mit der die 2D/3D-OSD-Generierung, Vektorgrafiken, hochwertiges Anti-Aliasing und Videoeffekte beschleunigt werden. Der Baustein auf Basis des ARM® Cortex™ A5 Quad-Core-Prozessors wird mit umfassenden Sicherheitsfunktionen zum Schutz von Inhalten gegen Piraterie geliefert, wie beispielsweise DVB-Entschlüsselung, DTCP, geschützter Programmstart und OTP zur Speicherung geheimer Schlüssel. Die äußerst geringe Leistungsaufnahme – in der Regel 2 Watt – prädestiniert den HD62 für den Einsatz in der Verbraucherelektronik, beispielsweise in hybriden Set-Top-Boxen für TV-Übertragungen und Streaming, DVB-T2-Set-Top-Boxen und Heimnetzwerken.

Das Kind einer globalen Entwicklungsumgebung

Das HD62-SoC wurde im ASIC Competence Center von FSEU in Langen bei Frankfurt entwickelt. Hier konnten alle Vorteile des Entwicklungssystems von Fujitsu für kundenspezifische System on Chips genutzt werden. Das Entwicklungssystem integriert hochmoderne Implementierungs- und Produktionstechniken, die über Jahre hinweg mit ASICs, Designdiensten und Entwicklungswerkzeugen gepflegt und ausgebaut wurden. Fujitsu produziert das SoC mit 55-nm-Prozesstechnologie in Japan in seinem Werk in der Präfektur Mie. Geliefert wird das Produkt im PBGA-484- Gehäuse.

Verfügbarkeit

Produktmuster aus der MB8AL2030-Serie, auch als HD62 bekannt, sind seit April 2014 verfügbar. Die Serienfertigung beginnt im ersten Quartal 2015.

Über Fujitsu Semiconductor Europe (FSEU)

Fujitsu Semiconductor Europe ist einer der wichtigsten Zulieferer von „Right-Sized“ und fortschrittlichen Halbleiterlösungen. Das Unternehmen mit Hauptsitz in Langen bei Frankfurt am Main bedient die Märkte Automotive, Industrial, Communications und Home Entertainment. Die „Right-Sized“-Strategie von FSEU ist darauf ausgerichtet, Kunden maßgeschneiderte Lösungen und eine höchstmögliche Wertschöpfungstiefe bieten zu können. Ingenieure der europäischen Design-Zentren sowie Forschungs- und Entwicklungseinrichtungen von Fujitsu, die sich analoger und Mixed-Signal-Technologie, Advanced Packaging, Mikrocontrollern, Grafikcontrollern, Multimedia ICs, ASICs und Embedded Software widmen, arbeiten eng mit Marketing- und Vertriebsteams in der EMEA-Region zusammen, um den Anforderungen der Kunden an deren Systementwicklung gerecht zu werden. FSEU-Teams stehen Kunden in Langen, München, Maidenhead bei London, Paris, Mailand, Budapest, Istanbul und Linz, Österreich mit technischem und anwendungsorientiertem Support zur Seite.

Unternehmenswebsite: http://emea.fujitsu.com/semiconductor
Newsletter: http://emea.fujitsu.com/newsletter
Twitter: http://emea.fujitsu.com/twitter

Firmenkontakt
Fujitsu Semiconductor Europe GmbH
Herr Mark Ellins
Pittlerstr. 47
63225 Langen
06103-6900
mark.ellins@de.fujitsu.com
http://emea.fujitsu.com/semiconductor

Pressekontakt
Hotwire
Florian Hohenauer
Franziska-Bilek-Weg 9
80339 München
+49 (0)89 210932-74
florian.hohenauer@hotwirepr.com
http://www.hotwirepr.com

Electric Electronics

Fujitsu Presents HEVC HD Decoding SoC for Multimedia Applications

Fujitsu Presents HEVC HD Decoding SoC for Multimedia Applications

Fujitsu presents the HEVC HD (H.265) decoding SoC for multimedia applications.

SoC supports H.265 decoding for set top boxes and in-car infotainment systems

Langen, Germany, August 26, 2014 – Fujitsu Semiconductor Europe (FSEU) today introduced its newest addition to the Fujitsu H6x decoder series: the MB8AL2030 nicknamed HD62. The System on Chip (SoC) supports HEVC (H.265) decoding in HD resolution for multimedia applications in in-car infotainment and home entertainment systems. H.265 is the successor to the widely used H.264, offering double the data compression ratio compared to its predecessor.

HD62 also includes an H.264 encoder and supports a 3D graphics engine to accelerate 2D/3D OSD generation, vector graphics, high-quality anti-aliasing and video effects. It comes with comprehensive security features for content protection including DVB descrambling, DTCP, secure boot and OTP to store secure keys, and builds on an ARM® Cortex™ A5 quad-core. It offers a very low power consumption, typically 2W, which makes it ideal for use in consumer electronics such as hybrid set-top boxes for broadcasting and streaming, DVB-T2 set-top boxes and home networking.

Leveraging a global development environment

The HD62 SoC was developed in FSEU“s ASIC Competence Centre in Langen, Germany, by leveraging Fujitsu“s development system for custom System on Chips, which integrates advanced device implementation and manufacturing techniques cultivated through years of experience with ASICs, design services, and development tool kits. The SoC is produced using 55nm process technology in Fujitsu“s Mie plant in Japan and comes in PBGA-484 packaging

Availability

Sample quantities of MB8AL2030, otherwise known as HD62, have been available since April 2014. Volume production will start in the first quarter of 2015.

Über Fujitsu Semiconductor Europe (FSEU)

Fujitsu Semiconductor Europe ist einer der wichtigsten Zulieferer von „Right-Sized“ und fortschrittlichen Halbleiterlösungen. Das Unternehmen mit Hauptsitz in Langen bei Frankfurt am Main bedient die Märkte Automotive, Industrial, Communications und Home Entertainment. Die „Right-Sized“-Strategie von FSEU ist darauf ausgerichtet, Kunden maßgeschneiderte Lösungen und eine höchstmögliche Wertschöpfungstiefe bieten zu können. Ingenieure der europäischen Design-Zentren sowie Forschungs- und Entwicklungseinrichtungen von Fujitsu, die sich analoger und Mixed-Signal-Technologie, Advanced Packaging, Mikrocontrollern, Grafikcontrollern, Multimedia ICs, ASICs und Embedded Software widmen, arbeiten eng mit Marketing- und Vertriebsteams in der EMEA-Region zusammen, um den Anforderungen der Kunden an deren Systementwicklung gerecht zu werden. FSEU-Teams stehen Kunden in Langen, München, Maidenhead bei London, Paris, Mailand, Budapest, Istanbul und Linz, Österreich mit technischem und anwendungsorientiertem Support zur Seite.

Unternehmenswebsite: http://emea.fujitsu.com/semiconductor
Newsletter: http://emea.fujitsu.com/newsletter
Twitter: http://emea.fujitsu.com/twitter

Firmenkontakt
Fujitsu Semiconductor Europe GmbH
Herr Mark Ellins
Pittlerstr. 47
63225 Langen
06103-6900
mark.ellins@de.fujitsu.com
http://emea.fujitsu.com/semiconductor

Pressekontakt
Hotwire
Florian Hohenauer
Franziska-Bilek-Weg 9
80339 München
+49 (0)89 210932-74
florian.hohenauer@hotwirepr.com
http://www.hotwirepr.com