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Asahi Kasei introduces the next-generation family of glass-reinforced PP Thermylene® P11 – targeted for key automotive and household applications

Asahi Kasei introduces the next-generation family of glass-reinforced PP Thermylene® P11 - targeted for key automotive and household applications

Asahi Kasei Thermylene® door module (Source: @Asahi Kasei)

Düsseldorf, June 11, 2018 – Asahi Kasei has launched Thermylene® P11, a next-generation family of glass-reinforced polypropylene (PP) compounds with unprecedented strength. With the new material, the leading global supplier of high-performance thermoplastic compounds expands the performance envelope for conventional glass reinforced polypropylene design and opens opportunities for thinwall molding of interior and exterior automotive parts.

The Thermylene® P11 family of chemically coupled PP compounds, currently available in 30%, 40%, 45% and 50% glass loadings, delivers the highest tensile strength without sacrificing other performance attributes. It provides an optimum balance of properties and facilitates thinwall molding for a wide range of applications.

The new family of Thermylene® P11 compounds offers higher tensile strength at elevated temperature, greater room temperature tensile, and improved fatigue and creep resistance compared to the predecessor material family, Thermylene® P10. Thinwall molding is possible thanks to Thermylene® P11″s melt flow of 10-25 g/10 min – specifically tunable to customer needs.

„The Thermylene® P11 family is a step change improvement which enables European automotive OEMs and tier suppliers to fine tune the necessary performance without worrying about any compromise. Asahi Kasei has received strong interest in the new family of glass-filled PP compounds with material evaluations currently underway at leading OEMs and tier suppliers,“ said Vive Apte, Manager of Polyolefins R&D at Asahi Kasei.

Asahi Kasei is targeting a range of structural parts in the automotive and appliance markets. In interior automotive, key applications include door modules, center consoles, load floors, and instrument panels. Underhood automotive parts include fan shrouds, battery trays, front end modules, and grille shutters. In appliance, Thermlyene® P11 is targeted for heat-exposed dryer components such as lint trays.

Thermylene® P11 provides up to 40% improvement in measured tensile strength at 80°C and 120°C compared to conventional glass-filled PP. Thermylene® P11 GF40% boasts flexural modulus of 10,000 MPa, tensile strength of 125 MPa, and a heat distortion temperature of 155°C.

P11 PP compounds can also be processed at a lower temperature and a higher fill rate, resulting in energy and cycle time savings. Thinner wall thicknesses can be achieved in new designs due to the high tensile and flexural modulus properties. Due to the material“s high flow, parts can be packed more efficiently resulting in lower porosity/voids.

About Asahi Kasei
Asahi Kasei Corporation is a globally active diversified technology company with operations in the Material, Homes, and Health Care business. The Material division encompasses fibers & textiles, petrochemicals, performance polymers, performance materials, consumables, battery separators, and electronic devices. The Homes division provides housing and construction materials to the Japanese market. The Health Care division includes pharmaceuticals, medical devices, and acute critical care devices and systems. With approximately 34,000 employees around the world, the Asahi Kasei Group serves customers in more than 100 countries.

Asahi Kasei is „Creating for Tomorrow“ with all operations sharing a common mission of contributing to life and living for people around the world. For more information, visit
www.asahi-kasei.co.jp/asahi/en/
www.asahi-kasei.eu/

The Asahi Kasei Group is a diversified group of companies led by Asahi Kasei Corp., with operations in the Material, Homes, and Health Care business sectors. Asahi Kasei distributes its innovative technologies and unique materials on markets worldwide.
With more than 30,000 employees around the world, the Asahi Kasei Group serves customers in more than 100 countries. Asahi Kasei is „Creating for Tomorrow“ with all operations sharing a common mission of contributing to life and living for people around the world.

Company-Contact
Asahi Kasei Europe GmbH
Sebastian Schmidt
Am Seestern 4
40547 Düsseldorf
Phone: +49 (0)211 280 68 139
E-Mail: Sebastian.Schmidt@asahi-kasei.eu
Url: https://www.asahi-kasei.eu/

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Henning Küll
Louisenstraße 97
61348 Bad Homburg
Phone: +49 (0) 6172 27159 12
E-Mail: h.kuell@financial-relations.de
Url: http://www.financial-relations.de

Electric Electronics

Fujitsu to Begin Sample Shipments of GaN Power Device with 150V Breakdown Voltage

Fujitsu to Begin Sample Shipments of GaN Power Device with 150V Breakdown Voltage

New Fujitsu GaN power device with 150V breakdown voltage.

Contributes to smaller, more efficient power supply products for use in telecommunications, industrial equipment, automotive, and other applications

Langen, Germany, July 17, 2013 – Fujitsu Semiconductor Europe (FSEU) today announced the release of MB51T008A, a silicon substrate-based, gallium-nitride (GaN) power device that features a breakdown voltage of 150 V. The new device, which enables normally-off operations, is capable of achieving roughly one half the figure of merit (FOM) of silicon-based power devices with an equivalent breakdown voltage. With the addition of the new product to its line-up, Fujitsu Semiconductor will be able to offer GaN devices that contribute to smaller, more efficient power supplies for a wide range of fields, from home appliances and ICT equipment to automotive and industrial applications. Sample quantities of the new product will be made available starting July 2013, the volume production is scheduled to begin in 2014.

The MB51T008A has a number of advantages, including on-state resistance of 13 m and total gate charge of 16 nC, which enables roughly half the FOM of silicon-based power devices with an equivalent breakdown voltage. It is characterised by minimal parasitic inductance and high-frequency operations through the use of WLCSP packaging; and a proprietary gate design that enables normally-off operations. The new device is ideal for high-side switches and low-side switches in DC-DC converters employed in power supplies for data communications equipment, industrial products, and automobiles. In addition, because it supports a higher switching frequency in power supply circuits, power supplies can achieve improvements in overall size and efficiency.

In addition to MB51T008A, which features a breakdown voltage of 150 V, Fujitsu Semiconductor is also developing models with breakdown voltages of 600 V and 30 V, thereby helping to enable enhanced power efficiency in a wide range of product areas. These GaN power devices are based on the High Electron Mobility Transistor (HEMT) technology, which Fujitsu Laboratories has led the development since the 1980s. Building on the rich IP portfolio of the technology, Fujitsu Semiconductor will rapidly bring its GaN power devices to market. It also plans to build partnerships with customers across a wide range of industries, in order to expand its business further.

The MB51T008A and other GaN products from Fujitsu Semiconductor will be on display at „TECHNO- FRONTIER 2013“, to be held July 17-19 at Tokyo Big Sight in Tokyo, Japan. The company also plans to highlight performance improvements in its GaN power devices with 600 V breakdown voltages, as well as prototypes and test data of a 2.5 kW power supply employing a GaN power device, a high-frequency PFC, and a high-frequency DC-DC converter.

Über Fujitsu Semiconductor Europe (FSEU)

Fujitsu Semiconductor Europe ist einer der wichtigsten Zulieferer von „Right-Sized“ und fortschrittlichen Halbleiterlösungen. Das Unternehmen mit Hauptsitz in Langen bei Frankfurt am Main bedient die Märkte Automotive, Industrial, Communications und Home Entertainment. Die „Right-Sized“-Strategie von FSEU ist darauf ausgerichtet, Kunden maßgeschneiderte Lösungen und eine höchstmögliche Wertschöpfungstiefe bieten zu können. Ingenieure der europäischen Design-Zentren sowie Forschungs- und Entwicklungseinrichtungen von Fujitsu, die sich analoger und Mixed-Signal-Technologie, Advanced Packaging, Mikrocontrollern, Grafikcontrollern, Multimedia ICs, ASICs und Embedded Software widmen, arbeiten eng mit Marketing- und Vertriebsteams in der EMEA-Region zusammen, um den Anforderungen der Kunden an deren Systementwicklung gerecht zu werden. FSEU-Teams stehen Kunden in Langen, München, Maidenhead bei London, Paris, Mailand, Budapest, Istanbul und Linz, Österreich mit technischem und anwendungsorientiertem Support zur Seite.

Unternehmenswebsite: http://emea.fujitsu.com/semiconductor
Newsletter: http://emea.fujitsu.com/newsletter
Twitter: http://emea.fujitsu.com/twitter

Kontakt
Fujitsu Semiconductor Europe GmbH
Rainer Reitz
Pittlerstr. 47
63225 Langen
06103-6900
rainer.reitz@de.fujitsu.com
http://emea.fujitsu.com/semiconductor

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